DE602005001107D1 - Techniken für Mikrokanalkühlung - Google Patents

Techniken für Mikrokanalkühlung

Info

Publication number
DE602005001107D1
DE602005001107D1 DE602005001107T DE602005001107T DE602005001107D1 DE 602005001107 D1 DE602005001107 D1 DE 602005001107D1 DE 602005001107 T DE602005001107 T DE 602005001107T DE 602005001107 T DE602005001107 T DE 602005001107T DE 602005001107 D1 DE602005001107 D1 DE 602005001107D1
Authority
DE
Germany
Prior art keywords
techniques
microchannel cooling
microchannel
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005001107T
Other languages
English (en)
Other versions
DE602005001107T2 (de
Inventor
Marc Scott Hodes
Paul Robert Kolodner
Thomas Nikita Krupenkin
Wonsuck Lee
Alan Michael Lyons
Todd Richard Salamon
Joseph Ashley Taylor
Donald P Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of DE602005001107D1 publication Critical patent/DE602005001107D1/de
Application granted granted Critical
Publication of DE602005001107T2 publication Critical patent/DE602005001107T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/04—Coatings; Surface treatments hydrophobic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE602005001107T 2004-11-24 2005-11-15 Techniken für Mikrokanalkühlung Active DE602005001107T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US997795 1997-12-24
US10/997,795 US7204298B2 (en) 2004-11-24 2004-11-24 Techniques for microchannel cooling

Publications (2)

Publication Number Publication Date
DE602005001107D1 true DE602005001107D1 (de) 2007-06-21
DE602005001107T2 DE602005001107T2 (de) 2008-01-10

Family

ID=35708577

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005001107T Active DE602005001107T2 (de) 2004-11-24 2005-11-15 Techniken für Mikrokanalkühlung

Country Status (5)

Country Link
US (1) US7204298B2 (de)
EP (1) EP1662852B1 (de)
JP (1) JP4949669B2 (de)
CN (1) CN100499091C (de)
DE (1) DE602005001107T2 (de)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7126822B2 (en) * 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
JP4218677B2 (ja) * 2005-03-08 2009-02-04 セイコーエプソン株式会社 マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
US20070028588A1 (en) * 2005-08-03 2007-02-08 General Electric Company Heat transfer apparatus and systems including the apparatus
US7666665B2 (en) * 2005-08-31 2010-02-23 Alcatel-Lucent Usa Inc. Low adsorption surface
US20070059213A1 (en) * 2005-09-15 2007-03-15 Lucent Technologies Inc. Heat-induced transitions on a structured surface
US8287808B2 (en) * 2005-09-15 2012-10-16 Alcatel Lucent Surface for reversible wetting-dewetting
US8734003B2 (en) * 2005-09-15 2014-05-27 Alcatel Lucent Micro-chemical mixing
US8721161B2 (en) 2005-09-15 2014-05-13 Alcatel Lucent Fluid oscillations on structured surfaces
TWM284949U (en) * 2005-09-21 2006-01-01 Yen Sun Technology Corp Heat dissipating device for an electronic device
US7289326B2 (en) * 2006-02-02 2007-10-30 Sun Microsystems, Inc. Direct contact cooling liquid embedded package for a central processor unit
US20080006389A1 (en) * 2006-06-27 2008-01-10 Ioan Sauciuc Preventing burst-related hazards in microelectronic cooling systems
US20080026505A1 (en) * 2006-07-28 2008-01-31 Nirupama Chakrapani Electronic packages with roughened wetting and non-wetting zones
US20080067502A1 (en) * 2006-09-14 2008-03-20 Nirupama Chakrapani Electronic packages with fine particle wetting and non-wetting zones
US7336487B1 (en) * 2006-09-29 2008-02-26 Intel Corporation Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
JP4697475B2 (ja) * 2007-05-21 2011-06-08 トヨタ自動車株式会社 パワーモジュールの冷却器及びパワーモジュール
TWI423403B (zh) 2007-09-17 2014-01-11 Ibm 積體電路疊層
US8927464B2 (en) * 2007-11-29 2015-01-06 President And Fellows Of Harvard College Assembly and deposition of materials using a superhydrophobic surface structure
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
DE102007059600A1 (de) * 2007-12-11 2008-10-23 Siemens Ag Kühlkörper
US20090161318A1 (en) * 2007-12-19 2009-06-25 Dialogic Corporation Thermal management systems and methods
US7928548B2 (en) 2008-01-07 2011-04-19 International Business Machines Corporation Silicon heat spreader mounted in-plane with a heat source and method therefor
US7866173B2 (en) 2008-02-28 2011-01-11 International Business Machines Corporation Variable performance server system and method of operation
US7808780B2 (en) 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
US8132299B2 (en) * 2008-03-27 2012-03-13 Nien Made Enterprise Co., Ltd. Cord safety device for a window covering
JP2009239043A (ja) * 2008-03-27 2009-10-15 Furukawa Electric Co Ltd:The 微細流路を備えた冷却装置、その製造方法
EP2119993A1 (de) * 2008-05-14 2009-11-18 ABB Research Ltd. Zweiphasiger Kühlkreislauf
US8286561B2 (en) 2008-06-27 2012-10-16 Ssw Holding Company, Inc. Spill containing refrigerator shelf assembly
US11786036B2 (en) 2008-06-27 2023-10-17 Ssw Advanced Technologies, Llc Spill containing refrigerator shelf assembly
FR2934709B1 (fr) * 2008-08-01 2010-09-10 Commissariat Energie Atomique Structure d'echange thermique et dispositif de refroidissement comportant une telle structure.
CA2739920C (en) 2008-10-07 2017-12-12 Ross Technology Corporation Spill-resistant surfaces having hydrophobic and oleophobic borders
JP2010243035A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
WO2010117874A2 (en) * 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
US20110067841A1 (en) * 2009-09-24 2011-03-24 Gm Global Technology Operations, Inc. Heat sink systems and devices
WO2011056742A1 (en) 2009-11-04 2011-05-12 Ssw Holding Company, Inc. Cooking appliance surfaces having spill containment pattern and methods of making the same
CA2796305A1 (en) 2010-03-15 2011-09-22 Ross Technology Corporation Plunger and methods of producing hydrophobic surfaces
US20120103574A1 (en) * 2010-11-01 2012-05-03 Mingwei Zhu Heating system utilizing waste heat from illuminating device
JP5218525B2 (ja) * 2010-11-09 2013-06-26 株式会社デンソー 熱輸送流体が流通する装置
SG181180A1 (en) * 2010-11-12 2012-06-28 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
US9612060B2 (en) 2010-12-07 2017-04-04 Intel Corporation Direct air impingement cooling of package structures
WO2013101212A1 (en) * 2011-12-30 2013-07-04 Intel Corporation Direct air impingement cooling of package structures
BR112013021231A2 (pt) 2011-02-21 2019-09-24 Ross Tech Corporation revestimentos super-hidrofóbicos e oleofóbicos com sistemas ligantes de baixo voc
EP2505913B1 (de) 2011-03-30 2016-03-23 Nxp B.V. Aktive Wärmeverwaltungsvorrichtung und Wärmeverwaltungsverfahren
US11129299B2 (en) * 2011-03-31 2021-09-21 Tejas Network Limited Heat sink
CN103459969A (zh) * 2011-04-13 2013-12-18 日本电气株式会社 冷却装置的管路结构、制造该管路结构的方法和用于连接管的方法
US8726505B2 (en) * 2011-07-13 2014-05-20 Revolution Lighting Technologies, Inc. Heat sinking methods for performance and scalability
DK2564975T3 (en) 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Selection apparatus with a plurality of lasers and sets of deflecting agents that can be individually adjusted
ES2530069T3 (es) 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y un dispositivo de desviación de combinación
ES2544034T3 (es) * 2011-09-05 2015-08-27 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con al menos un láser de gas y un termodisipador
ES2452529T3 (es) 2011-09-05 2014-04-01 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo láser y procedimiento para marcar un objeto
EP2564974B1 (de) 2011-09-05 2015-06-17 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mit mehreren Resonatorröhren aufweisenden Gas-Lasern und einzel justierbaren Deflektoren
EP2564972B1 (de) 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mith mehreren Lasern, Deflektionmitteln und Telescopikmitteln für jeden Laserstrahl
DE102011085428A1 (de) 2011-10-28 2013-05-02 Schott Ag Einlegeboden
TW201319505A (zh) * 2011-11-08 2013-05-16 Ind Tech Res Inst 散熱裝置與散熱系統
EP2791255B1 (de) 2011-12-15 2017-11-01 Ross Technology Corporation Zusammensetzung und beschichtung für superhydrophobe leistung
US20130244001A1 (en) * 2012-03-02 2013-09-19 Massachusetts Institute Of Technology Superhydrophobic Nanostructures
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
EP2848101B1 (de) * 2012-05-07 2019-04-10 Phononic Devices, Inc. Thermoelektrische wärmetauscherkomponente mit wärmeverteilungsschutzklappe und optimalem thermischem grenzflächenwiderstand
CA2878189C (en) 2012-06-25 2021-07-13 Ross Technology Corporation Elastomeric coatings having hydrophobic and/or oleophobic properties
US9038407B2 (en) * 2012-10-03 2015-05-26 Hamilton Sundstrand Corporation Electro-hydrodynamic cooling with enhanced heat transfer surfaces
US9730365B2 (en) * 2012-12-30 2017-08-08 General Electric Company Heat sink apparatus and method for power semiconductor device module
JP5534067B1 (ja) * 2013-03-06 2014-06-25 日本電気株式会社 電子部品、および電子部品冷却方法
US9230878B2 (en) * 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
WO2015033515A1 (ja) * 2013-09-04 2015-03-12 三菱電機株式会社 半導体モジュール及びインバータ装置
US9041193B2 (en) * 2013-09-17 2015-05-26 Hamilton Sundstrand Corporation Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
CN103489838B (zh) * 2013-10-15 2016-04-06 北京大学 一种强化散热三维封装结构及其封装方法
CN104681514A (zh) * 2013-12-03 2015-06-03 上海北京大学微电子研究院 一种fc封装芯片的水冷散热方案
WO2015142607A1 (en) * 2014-03-21 2015-09-24 Board Of Regents, The University Of Texas System Heat pipes with electrical pumping of condensate
RU2581342C2 (ru) * 2014-06-06 2016-04-20 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Способ изготовления системы охлаждения электронного и микроэлектронного оборудования
US9220183B1 (en) 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device
RU2588917C1 (ru) * 2014-12-15 2016-07-10 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство для формирования ручейкового течения жидкости в микро- и мини-каналах (варианты)
TWM512883U (zh) * 2015-05-05 2015-11-21 Cooler Master Co Ltd 散熱模組、水冷式散熱模組及散熱系統
ES2603785B1 (es) * 2015-09-01 2017-12-12 Bsh Electrodomésticos España, S.A. Componente de aparato doméstico que comprende un elemento base
US20170142862A1 (en) * 2015-11-13 2017-05-18 Dyi-chung Hu Heatsink with nanotwinned copper wall
RU2629516C2 (ru) * 2015-12-28 2017-08-29 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство для формирования микроручейкового течения жидкости в микро- и миниканалах
CN105588465A (zh) * 2016-02-29 2016-05-18 华南理工大学 一种具有低表面能换热特性的双层微细通道群组换热器
US10568240B2 (en) 2016-06-30 2020-02-18 Ford Global Technologies, Llc Coolant flow distribution using coating materials
US10317962B2 (en) 2016-08-16 2019-06-11 International Business Machines Corporation Inducing heterogeneous microprocessor behavior using non-uniform cooling
US10770372B2 (en) 2016-09-23 2020-09-08 Altera Corporation Fluid routing devices and methods for cooling integrated circuit packages
US10558249B2 (en) 2016-09-27 2020-02-11 International Business Machines Corporation Sensor-based non-uniform cooling
CN106802095A (zh) * 2017-01-20 2017-06-06 中国石油大学(华东) 一种微通道冷却器
US10964624B2 (en) 2017-01-26 2021-03-30 Intel Corporation Techniques for fluid cooling of integrated circuits in packages
US10760672B2 (en) * 2017-03-29 2020-09-01 Ford Global Technologies, Llc Coolant system pressure drop reduction
US11000077B2 (en) 2017-07-10 2021-05-11 ThermoBionics LLC System, method, and apparatus for providing cooling
DE102018113341B4 (de) * 2018-06-05 2023-08-31 Hanon Systems Vorrichtungen zur Wärmeübertragung
US10553516B1 (en) 2018-08-13 2020-02-04 International Business Machines Corporation Semiconductor microcooler
US10553522B1 (en) 2018-08-13 2020-02-04 International Business Machines Corporation Semiconductor microcooler
US11735495B2 (en) * 2019-02-27 2023-08-22 Intel Corporation Active package cooling structures using molded substrate packaging technology
DE202019101687U1 (de) * 2019-03-25 2020-06-26 Reinz-Dichtungs-Gmbh Temperierplatte mit einem mikrostrukturierten Flüssigkeitskanal, insbesondere für Kraftfahrzeuge
CN111001982B (zh) * 2019-11-25 2022-03-29 大连理工大学 一种具有梳齿式结构的金属铜微通道热沉及制作方法
US11404351B2 (en) 2020-04-21 2022-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. Chip-on-chip power card with embedded direct liquid cooling
CN111584448B (zh) * 2020-05-19 2022-03-29 上海先方半导体有限公司 一种芯片埋入式微流道模组封装结构及制作方法
CN113651288B (zh) * 2021-07-07 2023-10-20 北京大学 一种用于制备间隔墙上具有纳米通孔的微通道结构的方法
US11733154B2 (en) * 2021-08-16 2023-08-22 International Business Machines Corporation Thermal interface material detection through compression
CN115714297A (zh) * 2023-01-06 2023-02-24 中国电子科技集团公司第十一研究所 一种非主动温控的空间固体激光器组件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
JP2000087921A (ja) * 1998-09-18 2000-03-28 Agency Of Ind Science & Technol 流動抵抗低減方法
KR100294317B1 (ko) * 1999-06-04 2001-06-15 이정현 초소형 냉각 장치
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
SE0000300D0 (sv) 2000-01-30 2000-01-30 Amersham Pharm Biotech Ab Microfluidic assembly, covering method for the manufacture of the assembly and the use of the assembly
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
JP2003156297A (ja) * 2001-11-16 2003-05-30 Komatsu Ltd 熱交換器
US6988535B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
JP2006516068A (ja) * 2002-11-01 2006-06-15 クーリギー インコーポレイテッド 発熱デバイスにおける温度均一性及びホットスポット冷却を実現する方法及び装置
US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20050211417A1 (en) * 2002-11-01 2005-09-29 Cooligy,Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US20040191127A1 (en) 2003-03-31 2004-09-30 Avinoam Kornblit Method and apparatus for controlling the movement of a liquid on a nanostructured or microstructured surface
US7156032B2 (en) 2003-08-22 2007-01-02 Lucent Technologies Inc. Method and apparatus for controlling friction between a fluid and a body
US8124423B2 (en) 2003-09-30 2012-02-28 Alcatel Lucent Method and apparatus for controlling the flow resistance of a fluid on nanostructured or microstructured surfaces

Also Published As

Publication number Publication date
JP4949669B2 (ja) 2012-06-13
US20060108097A1 (en) 2006-05-25
DE602005001107T2 (de) 2008-01-10
JP2006148117A (ja) 2006-06-08
CN1819165A (zh) 2006-08-16
CN100499091C (zh) 2009-06-10
US7204298B2 (en) 2007-04-17
EP1662852B1 (de) 2007-05-09
EP1662852A1 (de) 2006-05-31

Similar Documents

Publication Publication Date Title
DE602005001107D1 (de) Techniken für Mikrokanalkühlung
DE602005001933D1 (de) Kühlsystem
DE502006006370D1 (de) Pipette
DE502006007895D1 (de) Spannvorrichtung
DE502005008168D1 (de) Pipette
DE502006001178D1 (de) Pipettiervorrichtung
DE502006004903D1 (de) Kolbenhubpipette
DE602005006942D1 (de) Kühlverdichter
DE502005010964D1 (de) Monoblock kühleinrichtungskomponente
SE0501654L (sv) Kylanordning
DE602005011371D1 (de) Kühlgerät
DE602006017145D1 (de) Fahrzeuge
DE502005005547D1 (de) Pipettiervorrichtung
DE602005027248D1 (de) Fingerhakenstruktur für schere
FI20051053L (fi) Jäähdytin
DE502005000334D1 (de) Spannvorrichtung
DE502006008367D1 (de) Pipettiervorrichtung
DE502006002069D1 (de) Spannvorrichtung
DE602004027762D1 (de) Kondensator für kühlvorrichtung
DK1773726T3 (da) Halsringkøling
DE112006003063A5 (de) Spannvorrichtung
DE502005007172D1 (de) Kühlsystem
DE502004008685D1 (de) Fadenführervorrichtung für ringspindel
DE602004031650D1 (de) Drehbund für hubsäge
DE112005003726A5 (de) Spannvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition