DE69826798D1 - Verfahren zur Herstellung einer Kühlungsdurchlass-enthaltenden Wärmesenke - Google Patents

Verfahren zur Herstellung einer Kühlungsdurchlass-enthaltenden Wärmesenke

Info

Publication number
DE69826798D1
DE69826798D1 DE69826798T DE69826798T DE69826798D1 DE 69826798 D1 DE69826798 D1 DE 69826798D1 DE 69826798 T DE69826798 T DE 69826798T DE 69826798 T DE69826798 T DE 69826798T DE 69826798 D1 DE69826798 D1 DE 69826798D1
Authority
DE
Germany
Prior art keywords
manufacturing
heat sink
cooling passage
containing heat
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69826798T
Other languages
English (en)
Other versions
DE69826798T2 (de
Inventor
Yoshiyuki Yamamoto
Takahiro Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69826798D1 publication Critical patent/DE69826798D1/de
Publication of DE69826798T2 publication Critical patent/DE69826798T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69826798T 1997-08-28 1998-07-23 Verfahren zur Herstellung einer Kühlungsdurchlass-enthaltenden Wärmesenke Expired - Lifetime DE69826798T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23220097A JP4048579B2 (ja) 1997-08-28 1997-08-28 冷媒流路を含む熱消散体とその製造方法
JP23220097 1997-08-28

Publications (2)

Publication Number Publication Date
DE69826798D1 true DE69826798D1 (de) 2004-11-11
DE69826798T2 DE69826798T2 (de) 2005-03-10

Family

ID=16935564

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69826798T Expired - Lifetime DE69826798T2 (de) 1997-08-28 1998-07-23 Verfahren zur Herstellung einer Kühlungsdurchlass-enthaltenden Wärmesenke

Country Status (5)

Country Link
US (1) US6129145A (de)
EP (1) EP0902470B1 (de)
JP (1) JP4048579B2 (de)
CA (1) CA2241402C (de)
DE (1) DE69826798T2 (de)

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FR2827079B1 (fr) * 2001-07-04 2004-05-28 Alstom Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procede
KR100429840B1 (ko) * 2001-07-19 2004-05-04 삼성전자주식회사 마이크로 냉각 장치
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US20040076408A1 (en) * 2002-10-22 2004-04-22 Cooligy Inc. Method and apparatus for removeably coupling a heat rejection device with a heat producing device
US6994151B2 (en) * 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US6988535B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US7227257B2 (en) 2002-12-09 2007-06-05 Intel Corporation Cooling micro-channels
JP2005013905A (ja) * 2003-06-27 2005-01-20 Sumitomo Electric Ind Ltd 化学反応用マイクロチップおよびその製造方法
US7021369B2 (en) * 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US7550841B2 (en) * 2006-03-23 2009-06-23 Intel Corporation Methods of forming a diamond micro-channel structure and resulting devices
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US8030754B2 (en) * 2007-01-31 2011-10-04 Hewlett-Packard Development Company, L.P. Chip cooling channels formed in wafer bonding gap
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US7738249B2 (en) 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
DE102007051797B3 (de) * 2007-10-26 2009-06-04 Jenoptik Laserdiode Gmbh Korrosionsbeständige Mikrokanalwärmesenke
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
WO2010017321A1 (en) 2008-08-05 2010-02-11 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20100078155A1 (en) * 2008-09-30 2010-04-01 Third Millennium Engineering Thin Cavity Fluidic Heat Exchanger
JP4775428B2 (ja) * 2008-11-20 2011-09-21 日本軽金属株式会社 ヒートプレートの製造方法
JP4775431B2 (ja) * 2008-12-09 2011-09-21 日本軽金属株式会社 ヒートプレートの製造方法
US8839519B2 (en) * 2009-11-16 2014-09-23 Raytheon Company Method of making cold chassis for electronic modules
JP5463224B2 (ja) 2010-07-09 2014-04-09 日本発條株式会社 流路付きプレートの製造方法、流路付きプレート、温度調節プレート、コールドプレート、及びシャワープレート
WO2012014516A1 (ja) * 2010-07-30 2012-02-02 Ｎｋワークス株式会社 Ｌｅｄ発光装置
GB201107736D0 (en) * 2011-05-10 2011-06-22 Element Six Holdings N V Composite diamond assemblies
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element
JP5534067B1 (ja) * 2013-03-06 2014-06-25 日本電気株式会社 電子部品、および電子部品冷却方法
US9480149B2 (en) 2013-12-10 2016-10-25 Brocade Communications Systems, Inc. Printed circuit board with fluid flow channels
US9220183B1 (en) 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
US11417584B2 (en) * 2017-09-25 2022-08-16 Sony Semiconductor Solutions Corporation Semiconductor device
CN109068538A (zh) * 2018-08-23 2018-12-21 西安交通大学 一种基于金刚石微流通道的液冷散热器结构及其制作方法
CN111843247A (zh) * 2020-06-28 2020-10-30 西安中科微精光子制造科技有限公司 一种在金刚石内部形成通道的方法及金刚石制品

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US5642779A (en) * 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
DE967450C (de) * 1952-08-27 1957-11-14 Siemens Ag Kuehleinrichtung fuer Trockengleichrichter mit Kuehlkanaelen
FR2012723A1 (de) * 1968-07-11 1970-03-20 Messerschmitt Boelkow Blohm
US3731992A (en) * 1972-04-06 1973-05-08 States Of Air Force Spiral grooved liquid cooled laser mirror
DE2418841C3 (de) * 1974-04-19 1979-04-26 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Wärmetauscher, insbesondere regenerativ gekühlte Brennkammern für Flüssigkeitsraketentriebwerke und Verfahren zu ihrer Herstellung
US4185369A (en) * 1978-03-22 1980-01-29 General Electric Company Method of manufacture of cooled turbine or compressor buckets
JPH0684852B2 (ja) * 1986-01-20 1994-10-26 株式会社東芝 極低温冷凍機
JPH07112030B2 (ja) * 1986-11-04 1995-11-29 株式会社フジクラ マイクロヒ−トパイプの製造方法
CH675019A5 (de) * 1987-08-04 1990-08-15 Sulzer Ag
CA2050091C (en) * 1990-10-03 1999-06-15 Richard C. Eden Electronic circuit and method with thermal management
FR2715502B1 (fr) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Structure présentant des cavités et procédé de réalisation d'une telle structure.
US5509046A (en) * 1994-09-06 1996-04-16 Regents Of The University Of California Cooled window for X-rays or charged particles
JP3528376B2 (ja) * 1994-11-30 2004-05-17 住友電気工業株式会社 基板の製造方法
JP3528375B2 (ja) * 1994-11-30 2004-05-17 住友電気工業株式会社 基板およびこれを用いた放熱基板、半導体装置、素子搭載装置
KR100264431B1 (ko) * 1994-11-30 2000-08-16 오카야마 노리오 윈도우재 및 그 제조방법
EP0715352B1 (de) * 1994-11-30 2003-07-30 Sumitomo Electric Industries, Ltd. Substrat, Halbleiteranordnung, Anordnung für Elementmontage
DE19514548C1 (de) * 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
DE19514545A1 (de) * 1995-04-20 1996-10-24 Daimler Benz Ag Anordnung von mehreren mit elektronischen Bauelementen versehenen Mikrokühleinrichtungen
DE19514542C2 (de) * 1995-04-20 1997-07-31 Daimler Benz Ag Komposit-Struktur und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
JP4048579B2 (ja) 2008-02-20
JPH1174614A (ja) 1999-03-16
DE69826798T2 (de) 2005-03-10
US6129145A (en) 2000-10-10
CA2241402C (en) 2003-12-02
EP0902470B1 (de) 2004-10-06
CA2241402A1 (en) 1999-02-28
EP0902470A3 (de) 1999-08-18
EP0902470A2 (de) 1999-03-17

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8320 Willingness to grant licences declared (paragraph 23)