US20100170657A1 - Integrated blower diffuser-fin heat sink - Google Patents
Integrated blower diffuser-fin heat sink Download PDFInfo
- Publication number
- US20100170657A1 US20100170657A1 US12/319,301 US31930109A US2010170657A1 US 20100170657 A1 US20100170657 A1 US 20100170657A1 US 31930109 A US31930109 A US 31930109A US 2010170657 A1 US2010170657 A1 US 2010170657A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- vanes
- diffuser
- air flow
- blower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to air-cooled heat-exchange systems used to remove heat from electronic devices that generate heat during operation.
- An integrated centrifugal blower-diffuser with a vaned heat-sink provides cooling of electronics and other devices that generate heat during use. Airflow is introduced radially onto the heat sink such that the centrifugal blower and fin-diffuser direct the bulk of the airflow outward across the available heat transfer area of the device. Air is induced through space in the shaft of an electric motor, and the air is then accelerated centrifugally through a set of rotating impellor vanes, and then diffused radially through a set of radial heat sink fins.
- the radial heat sink fins form the spiral diffuser fins (or vanes) to provide pressure recovery within the heat sink. This enables tight intra-vane spacing and increased heat transfer surface area.
- the device may also include passive vanes, surface features and microfabricated active elements to provide heat transfer enhancement at reduced air flow rates, thus providing reduced thermal resistance of the heat sink device.
- FIG. 1 is a perspective view of an integrated blower and diffuser.
- FIG. 2 is a partially cut away view of the devices in FIG. 1 .
- FIG. 3 is a side sectional view of the device in FIG. 1 .
- FIG. 4 is a top section view of the device in FIG. 1 .
- FIG. 5 is a view showing stationary vanes and active fin elements of the device shown in FIG. 1 .
- Air cooling system 10 for cooling component C is shown in FIG. 1 .
- System 10 includes motor 11 , blower 13 , cover 14 , diffuser 15 and heat sink base 17 .
- the heat sink base 17 may be an integral part of system 10 , or it may be part of component C being cooled.
- the diffuser 15 also functions with heat sink base 17 as part of a heat sink.
- the motor 11 and blower 13 are integral and are mounted on cover 14 , which also serves as the top of the diffuser 15 and supports all of the elements between cover 14 and heat sink base 17 .
- System 10 cools objects it is in heat transfer contact with, such as an electronic device shown generically as component C. Any object generating heat can be cooled by system 10 if it can be placed in heat transfer contact therewith.
- Motor 11 is shown as a toroidal electric motor with a central airway 12 around its rotational axis. Air is drawn by rotation of blower 13 axially down through central airway 12 into blower 13 and then into diffuser 15 . Air flows outward. Other motors may also be used, with different configurations and sources of power, depending on the size and shape of the object to be cooled. Controller 31 provides a source of energy via line 29 to drive motor 11 and other active components described below. In operation, motor 11 causes air to be drawn into central airway 12 by blower 13 , passing through a central aperture in cover 14 into diffuser 15 . The air flows through diffuser 15 and in contact with heat sink base 17 to cool component C. Airflow through diffuser 15 can be radial, spiral or diffuser 15 can be configured for other paths.
- Motor 11 includes a housing 11 a, bearings 18 , permanent magnet rotor 19 , stator 20 , and stator windings 20 a to support rotation of the rotor 19 and blower 13 .
- Stator winding 20 a are positioned to receive electrical power from controller 31 and drive the blower 13 in a normal electric motor fashion.
- Blower 13 has an upper hub 13 a, lower hub 13 b and blades 16 .
- Upper hub 13 a is connected to the permanent magnet rotor 19 .
- Blades 16 have an upper end 16 a connected to lower hub 13 b.
- a center port 13 c in lower hub 13 b provides a passage for air flow through lower hub 13 b and into space between lower hub 13 b and heat sink base 17 .
- Diffuser 15 includes a plurality of fins or vanes 23 and other elements shown and described below that take air from central passage 12 so that air contacts the vanes 23 and the heat sink base 17 to absorb heat into the air and out of system 10 .
- Diffuser 15 serves two purposes in this device. First, diffuser 15 deflects the flow of air from a vertically downward direction radially outward as will be described below, Second, the diffuser vanes 23 provide additional heat conductive material as part of the heat sink 17 , so that more hot metal is exposed to the cooling air flow. This is a significant improvement over conventional designs that simply direct the air flow axially to impinge on a heat sink.
- the motor 11 , blower 13 , diffuser 15 and heat sink 17 are attached together to form a single device that can be attached to an electronic package such as a circuit board in the same manner that conventional air-cooled heat-exchangers are attached.
- Air flow in FIG. 3 is pulled down into system 10 central airway 12 by blower blades 16 into a radial direction. This air passes through the channels formed by vanes 23 , transferring heat from the heat sink 17 and from vanes 23 into the air as it flows out of system 10 , and, accordingly, cooling the object on which heat sink 17 is positioned.
- Vanes 23 are made from heat conductive materials such as metals. Aluminum and copper vanes are effective conductors. System 10 is compact and yet provides a great increase in the surface area of the heat sink.
- FIG. 4 is another view of the relationship of the blower blades 16 , the heat sink base 17 and the vanes 23 , and illustrates the spiral configuration of the vanes 23 .
- Air is drawn by blower blades 16 through central passage 12 and down into the diffuser 15 .
- Diffuser 15 also include secondary vanes or splitter plates 23 a and 23 b at the ends of the channels formed by vanes 23 and mounted on vanes 23 to narrow the channel and further disrupt air flow and improve heat transfer.
- Also seen in FIG. 4 are a plurality of posts 25 that support reeds 27 for further disruption of the air flow and thus further heat transfer and cooling. Posts 25 are supported between cover 14 and heat sink base 17 .
- Reeds 27 may be passive or active, as described below.
- FIG. 5 illustrates several additional ways to improve the cooling of the device.
- Vanes 23 have been further modified to decrease fin-to-air heat transfer resistance by the use of microfabricated dimples 24 , seen in FIG. 5 .
- Dimples 24 are created through a bipolar anodization process that has been shown to enhance air side heat transfer by from about 10% to about 30% over undimpled vanes. Other method of putting dimples 24 , or other surface irregularities can be used.
- FIG. 5 also illustrates the placement of vanes 23 with respect to splitter plates 23 a and 23 b to provide a larger quantity of heat conductive material in contact with the flowing air.
- the splitter plates 23 a and 23 b of vane 23 decrease the channel width. This increases the resistance to flow and increases heat transfer.
- Splitter plates 23 a and 23 b are made from heat conductive materials and may be made from the same or different materials as supporting vanes 23 .
- FIG. 5 two vanes 23 are shown with post 25 for mounting reeds 27 , although reeds 27 are only visible in FIG. 5 for the vane on the left.
- FIG. 4 shows the plurality of vanes 23 , ends 23 a and 23 b, posts 25 and reeds 27 .
- Post 25 is supported by cover 14 and heat sink base 17 , as noted above.
- Post 25 contains a piezoelectric component that excites reeds 27 to vibrate, or reeds 27 may be piezoelectric elements.
- Reeds 27 are designed to function as vibrating reeds in the space between adjacent fins to further improve heat transfer.
- reeds 27 are formed from a silicon material having a piezoelectric component bonded to the silicon so that when the piezoelectric component is actuated by an electric signal in wire 29 from controller 31 in FIG. 1 , the reed 27 vibrates.
- the signal driving the piezoelectric component may be the same signal driving motor 11 or it may be a different signal.
- the appropriate signal in wire 29 is directed to all the reeds 27 by a printed circuit on cover 14 to the post 25 that also has an electronic circuit printed thereon. Hard wiring is also an alternative method for exciting the piezoelectric component.
- Vibrating reed 27 introduces a high frequency, unsteady flow within the channels formed by fins 23 that greatly enhances air mixing and heat transfer from the fin wall 23 to the air flowing through them.
- Use of vibrating fins or reeds 27 has been shown to increase heat transfer coefficients downstream by more than 50% with only a negligible increase in the power requirement and pressure drop.
- the combination of dimples 24 on vanes 23 , splitter plates 23 a and 23 b, and the vibrating reeds 27 function as highly integrated active fin, and operate through the introduction of high frequency, unsteady flow within the channels formed by them. This greatly enhances mixing and heat transfer from their walls to the air. This well-mixed air is swept through the thus formed channels by the bulk airflow provided by the blower 13 .
- a conventional device has a thermal resistance of 0.2° C./W, which gives a temperature rise of 230° C., which is above the allowed operating temperature of many electronic devices.
- the system of this invention is estimated to have a thermal resistance of 0.05° C./W, resulting in a theoretical temperature rise of only 50° C. The system would be usable with many more electronic devices.
- the Coefficient of Performance (COP) is the electronic device power dissipation divided by the blower and heat sink power. For the conventional system, the COP is 100. Simulated results for the system of this invention is estimated to produces a COP of as low as 30, which results in an estimated power consumption reduction of more than a factor of three. These results are due to the substantial reduction in the airflow and increasing the back-pressure on the blower. This significantly improves operating point efficiency as well as providing a reduction in thermal resistance.
Abstract
An air-cooled heat exchange device for cooling an object such as an electronic device generating heat during use. The device includes a toroidal electric motor with a centrifugal blower for directing air flow in a downward and outward direction, a heat sink positioned to receive the air flow from the blower; and a spiral diffuser as part of the heat sink, the diffuser having vanes for directing the air flow spirally over the heat sink. The vanes may include microfabricated vibrating reeds and a plurality of microfabricated dimples on at least some of the vanes.
Description
- The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of [Contract No. or Grant No.] ______ awarded by Defense Advanced Research Projects Agency/Microsystems Technology Office.
- The present invention relates to air-cooled heat-exchange systems used to remove heat from electronic devices that generate heat during operation.
- Over the past 40 years, many electronic technologies such as telecommunications, and active sensing and imaging have undergone tremendous technological innovation. During this same time, the technologies, designs and performance of air-cooled heat exchangers has remained fundamentally unchanged. Performance data for present day heat exchangers and blowers is based on that old technology.
- Because of the improved performance and increased power consumption of electronic technologies, heat rejection systems have grown in size, weight, complexity and cost. In some instances, conventional air-cooled heat sinks have become inadequate. This has resulted in more exotic liquid-cooled manifolds, spray-cooled enclosures, and vapor-compression refrigeration being proposed. All these newly proposed cooling approaches add complexity associated with operation of active pumps and compressors, as well as the need to prevent fluid or vapor leakage. Reliability of those approaches has not been demonstrated at this time.
- Conventional designs rely on high heat transfer impingement flows generated by axial fans placed above the heat sink. Airflow at the fan outer diameter passes over a portion of the available heat transfer area, thus requiring high airflow rates and high fan power input.
- An integrated centrifugal blower-diffuser with a vaned heat-sink provides cooling of electronics and other devices that generate heat during use. Airflow is introduced radially onto the heat sink such that the centrifugal blower and fin-diffuser direct the bulk of the airflow outward across the available heat transfer area of the device. Air is induced through space in the shaft of an electric motor, and the air is then accelerated centrifugally through a set of rotating impellor vanes, and then diffused radially through a set of radial heat sink fins. The radial heat sink fins form the spiral diffuser fins (or vanes) to provide pressure recovery within the heat sink. This enables tight intra-vane spacing and increased heat transfer surface area.
- The device may also include passive vanes, surface features and microfabricated active elements to provide heat transfer enhancement at reduced air flow rates, thus providing reduced thermal resistance of the heat sink device.
-
FIG. 1 is a perspective view of an integrated blower and diffuser. -
FIG. 2 is a partially cut away view of the devices inFIG. 1 . -
FIG. 3 is a side sectional view of the device inFIG. 1 . -
FIG. 4 is a top section view of the device inFIG. 1 . -
FIG. 5 is a view showing stationary vanes and active fin elements of the device shown inFIG. 1 . -
Air cooling system 10 for cooling component C is shown inFIG. 1 .System 10 includesmotor 11,blower 13,cover 14,diffuser 15 andheat sink base 17. Theheat sink base 17 may be an integral part ofsystem 10, or it may be part of component C being cooled. InFIG. 1 , thediffuser 15 also functions withheat sink base 17 as part of a heat sink. Themotor 11 andblower 13 are integral and are mounted oncover 14, which also serves as the top of thediffuser 15 and supports all of the elements betweencover 14 andheat sink base 17.System 10 cools objects it is in heat transfer contact with, such as an electronic device shown generically as component C. Any object generating heat can be cooled bysystem 10 if it can be placed in heat transfer contact therewith. -
Motor 11 is shown as a toroidal electric motor with acentral airway 12 around its rotational axis. Air is drawn by rotation ofblower 13 axially down throughcentral airway 12 intoblower 13 and then intodiffuser 15. Air flows outward. Other motors may also be used, with different configurations and sources of power, depending on the size and shape of the object to be cooled.Controller 31 provides a source of energy vialine 29 to drivemotor 11 and other active components described below. In operation,motor 11 causes air to be drawn intocentral airway 12 byblower 13, passing through a central aperture incover 14 intodiffuser 15. The air flows throughdiffuser 15 and in contact withheat sink base 17 to cool component C. Airflow throughdiffuser 15 can be radial, spiral ordiffuser 15 can be configured for other paths. - As seen in
FIG. 2 , the internal components ofsystem 10 are shown.Motor 11 includes ahousing 11 a,bearings 18,permanent magnet rotor 19,stator 20, andstator windings 20 a to support rotation of therotor 19 andblower 13. Stator winding 20 a are positioned to receive electrical power fromcontroller 31 and drive theblower 13 in a normal electric motor fashion. - Blower 13 has an
upper hub 13 a,lower hub 13 b andblades 16.Upper hub 13 a is connected to thepermanent magnet rotor 19.Blades 16 have anupper end 16 a connected tolower hub 13 b. Acenter port 13 c inlower hub 13 b provides a passage for air flow throughlower hub 13 b and into space betweenlower hub 13 b andheat sink base 17. - Diffuser 15 includes a plurality of fins or
vanes 23 and other elements shown and described below that take air fromcentral passage 12 so that air contacts thevanes 23 and theheat sink base 17 to absorb heat into the air and out ofsystem 10. Diffuser 15 serves two purposes in this device. First,diffuser 15 deflects the flow of air from a vertically downward direction radially outward as will be described below, Second, thediffuser vanes 23 provide additional heat conductive material as part of theheat sink 17, so that more hot metal is exposed to the cooling air flow. This is a significant improvement over conventional designs that simply direct the air flow axially to impinge on a heat sink. Themotor 11,blower 13,diffuser 15 andheat sink 17 are attached together to form a single device that can be attached to an electronic package such as a circuit board in the same manner that conventional air-cooled heat-exchangers are attached. - Air flow in
FIG. 3 is pulled down intosystem 10central airway 12 byblower blades 16 into a radial direction. This air passes through the channels formed byvanes 23, transferring heat from theheat sink 17 and fromvanes 23 into the air as it flows out ofsystem 10, and, accordingly, cooling the object on whichheat sink 17 is positioned.Vanes 23 are made from heat conductive materials such as metals. Aluminum and copper vanes are effective conductors.System 10 is compact and yet provides a great increase in the surface area of the heat sink. -
FIG. 4 is another view of the relationship of theblower blades 16, theheat sink base 17 and thevanes 23, and illustrates the spiral configuration of thevanes 23. Air is drawn byblower blades 16 throughcentral passage 12 and down into thediffuser 15. Diffuser 15 also include secondary vanes orsplitter plates vanes 23 and mounted onvanes 23 to narrow the channel and further disrupt air flow and improve heat transfer. Also seen inFIG. 4 are a plurality ofposts 25 that supportreeds 27 for further disruption of the air flow and thus further heat transfer and cooling.Posts 25 are supported betweencover 14 andheat sink base 17. Reeds 27 may be passive or active, as described below. - In addition to the basic flow pattern as seen in
FIGS. 3 and 4 ,FIG. 5 illustrates several additional ways to improve the cooling of the device.Vanes 23 have been further modified to decrease fin-to-air heat transfer resistance by the use ofmicrofabricated dimples 24, seen inFIG. 5 .Dimples 24 are created through a bipolar anodization process that has been shown to enhance air side heat transfer by from about 10% to about 30% over undimpled vanes. Other method of puttingdimples 24, or other surface irregularities can be used. -
FIG. 5 also illustrates the placement ofvanes 23 with respect tosplitter plates splitter plates vane 23 decrease the channel width. This increases the resistance to flow and increases heat transfer.Splitter plates vanes 23. - In
FIG. 5 , twovanes 23 are shown withpost 25 for mountingreeds 27, althoughreeds 27 are only visible inFIG. 5 for the vane on the left.FIG. 4 shows the plurality ofvanes 23, ends 23 a and 23 b, posts 25 andreeds 27.Post 25 is supported bycover 14 andheat sink base 17, as noted above.Post 25 contains a piezoelectric component that excitesreeds 27 to vibrate, orreeds 27 may be piezoelectric elements. -
Reeds 27 are designed to function as vibrating reeds in the space between adjacent fins to further improve heat transfer. In one embodiment,reeds 27 are formed from a silicon material having a piezoelectric component bonded to the silicon so that when the piezoelectric component is actuated by an electric signal inwire 29 fromcontroller 31 inFIG. 1 , thereed 27 vibrates. The signal driving the piezoelectric component may be the samesignal driving motor 11 or it may be a different signal. The appropriate signal inwire 29 is directed to all thereeds 27 by a printed circuit oncover 14 to thepost 25 that also has an electronic circuit printed thereon. Hard wiring is also an alternative method for exciting the piezoelectric component. Vibratingreed 27 introduces a high frequency, unsteady flow within the channels formed byfins 23 that greatly enhances air mixing and heat transfer from thefin wall 23 to the air flowing through them. Use of vibrating fins orreeds 27 has been shown to increase heat transfer coefficients downstream by more than 50% with only a negligible increase in the power requirement and pressure drop. - The combination of
dimples 24 onvanes 23,splitter plates reeds 27 function as highly integrated active fin, and operate through the introduction of high frequency, unsteady flow within the channels formed by them. This greatly enhances mixing and heat transfer from their walls to the air. This well-mixed air is swept through the thus formed channels by the bulk airflow provided by theblower 13. - A simulated comparison between the present system described above and in the figures and a conventional air-cooled exchanger system shows significant improvement achieved by the present invention.
- A conventional device has a thermal resistance of 0.2° C./W, which gives a temperature rise of 230° C., which is above the allowed operating temperature of many electronic devices. The system of this invention is estimated to have a thermal resistance of 0.05° C./W, resulting in a theoretical temperature rise of only 50° C. The system would be usable with many more electronic devices. The Coefficient of Performance (COP) is the electronic device power dissipation divided by the blower and heat sink power. For the conventional system, the COP is 100. Simulated results for the system of this invention is estimated to produces a COP of as low as 30, which results in an estimated power consumption reduction of more than a factor of three. These results are due to the substantial reduction in the airflow and increasing the back-pressure on the blower. This significantly improves operating point efficiency as well as providing a reduction in thermal resistance.
- Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
Claims (22)
1. An air-cooled heat exchange device for cooling an object, comprising:
a centrifugal blower for directing air flow in a downward and outward direction;
a heat sink base positioned to receive the air flow from the blower; and
a diffuser on the heat sink base and in the path of the air flow from the blower, the diffuser having vanes that are in thermal communication with the heat sink base and that direct the air flow from the blower outward over the heat sink base.
2. The device of claim 1 , where the object being cooled is an electronic device generating heat during use, the electronic device being positioned in contact with the heat sink.
3. The device of claim 1 , wherein the centrifugal blower is driven by a torriodal electric motor and the downward direction is through the center of the motor.
4. The device of claim 1 , wherein the diffuser further includes secondary vanes in the air flow channels defined by the vanes to prevent flow separation and increase heat transfer surface area.
5. The device of claim 1 , wherein the vanes comprise a diffuser set of vanes forming air flow channels above the heat sink extending spirally out from the center of the heat sink.
6. The device of claim 1 , wherein the diffuser further includes vibrating reeds in the vane channels defined by the vanes.
7. The device of claim 6 , wherein the vibrating reeds include a piezoelectric component and means for actuating it to cause the reeds to vibrate.
8. The device of claim 1 , which further includes a plurality of microfabricated surface features on at least some of the vanes to increase heat transfer area per unit volume.
9. The device of claim 8 where the plurality of microfabricated surface features are dimples.
10. The device of claim 1 , wherein the centrifugal blower extends downward into and is surrounded by the diffuser.
11. The device of claim 10 , wherein the centrifugal blower includes an upper hub, a lower hub, and a plurality of blades connected between the upper hub and the lower hub.
12. The device of claim 11 , wherein the lower hub includes a port for allowing passage of air downward through the lower hub into a space between the lower hub and the heat sink base.
13. The device of claim 11 and further comprising a toroidal electric motor mounted on the diffuser and having a stator, a rotor, and a central air passage, the rotor being connected to the upper hub of the centrifugal blower.
14. A method of cooling an object using an air-cooled heat exchanging device, comprising the steps of:
directing air flow in a downward and outward direction using a blower; and
directing the air flow through a diffuser in thermal communication with a heat sink base positioned to receive the air flow from the blower and directing it outward over the heat sink base.
15. The method of claim 14 , wherein the object being cooled is an electronic device generating heat during use, the electronic device being positioned in contact with the heat sink.
16. The method of claim 14 , wherein the centrifugal blower is a torroidal electric motor and the downward direction is through the center of the motor.
17. The method of claim 14 , wherein the diffuser vains comprises a set of vanes forming air flow channels above the heat sink extending radially out from the center of the heat sink.
18. The method of claim 17 , which further includes secondary vanes on the outer ends of the vanes to prevent separation of airflow and increase heat transfer surface area.
19. The method of claim 17 , which further includes vibrating reeds in the flow channels.
20. The method of claim 19 , wherein the vibrating reeds include a piezoelectric component for causing the reeds to vibrate.
21. The method of claim 17 , which further includes a plurality of microfabricated surface features on at least some of the vanes to increase heat transfer area per unit volume.
22. The method of claim 21 where the plurality of microfabricated surface features are dimples.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/319,301 US20100170657A1 (en) | 2009-01-06 | 2009-01-06 | Integrated blower diffuser-fin heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/319,301 US20100170657A1 (en) | 2009-01-06 | 2009-01-06 | Integrated blower diffuser-fin heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100170657A1 true US20100170657A1 (en) | 2010-07-08 |
Family
ID=42310959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/319,301 Abandoned US20100170657A1 (en) | 2009-01-06 | 2009-01-06 | Integrated blower diffuser-fin heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | US20100170657A1 (en) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110299244A1 (en) * | 2010-06-08 | 2011-12-08 | Toyota Motor Engineering & Manufacturing | Cooling member for heat containing device |
US20120055653A1 (en) * | 2010-09-03 | 2012-03-08 | Wistron Corporation | Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit |
US8295046B2 (en) | 2010-07-19 | 2012-10-23 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
US8331091B2 (en) | 2010-09-01 | 2012-12-11 | Hamilton Sundstrand Corporation | Electronics package with radial heat sink and integrated blower |
US20120313980A1 (en) * | 2009-12-21 | 2012-12-13 | Martin Professional A/S | Cooling Module For Multiple Light Source Projecting Device |
WO2014092881A1 (en) * | 2012-12-11 | 2014-06-19 | GE Lighting Solutions, LLC | Active cooling device |
US20150342091A1 (en) * | 2014-05-23 | 2015-11-26 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
GB2528161A (en) * | 2014-07-09 | 2016-01-13 | Hamilton Sundstrand Corp | Integrated blower diffuser-fin single phase heat exchanger |
US20160057890A1 (en) * | 2014-08-25 | 2016-02-25 | Hamilton Sundstrand Corporation | Heat exchange device in directed flow system |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
US10222102B2 (en) | 2015-10-21 | 2019-03-05 | Ami Industries, Inc. | Thermoelectric based heat pump configuration |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US20190267308A1 (en) * | 2018-02-26 | 2019-08-29 | Toyota Jidosha Kabushiki Kaisha | Heat dissipation fin structure and cooling structure for electric substrate using the same |
US10866038B2 (en) * | 2018-10-25 | 2020-12-15 | United Arab Emirates University | Heat sinks with vibration enhanced heat transfer for non-liquid heat sources |
US10998253B1 (en) | 2019-12-23 | 2021-05-04 | Google Llc | Fluid diverting heat sink |
US11039550B1 (en) | 2020-04-08 | 2021-06-15 | Google Llc | Heat sink with turbulent structures |
US11098953B2 (en) | 2015-04-10 | 2021-08-24 | Carrier Corporation | Integrated fan heat exchanger |
US11270925B2 (en) | 2020-05-28 | 2022-03-08 | Google Llc | Heat distribution device with flow channels |
US20220252359A1 (en) * | 2021-02-09 | 2022-08-11 | Raytheon Technologies Corporation | Three-dimensional diffuser-fin heat sink with integrated blower |
Citations (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592260A (en) * | 1969-12-05 | 1971-07-13 | Espey Mfg & Electronics Corp | Heat exchanger with inner guide strip |
US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
US4838041A (en) * | 1987-02-05 | 1989-06-13 | Gte Laboratories Incorporated | Expansion/evaporation cooling system for microelectronic devices |
US5224538A (en) * | 1991-11-01 | 1993-07-06 | Jacoby John H | Dimpled heat transfer surface and method of making same |
US5661638A (en) * | 1995-11-03 | 1997-08-26 | Silicon Graphics, Inc. | High performance spiral heat sink |
US5730213A (en) * | 1995-11-13 | 1998-03-24 | Alliedsignal, Inc. | Cooling tube for heat exchanger |
US5867365A (en) * | 1997-06-10 | 1999-02-02 | Chiou; Ming Chin | CPU heat sink assembly |
US5927385A (en) * | 1998-01-21 | 1999-07-27 | Yeh; Ming Hsin | Cooling device for the CPU of computer |
US5943209A (en) * | 1997-10-06 | 1999-08-24 | Liu; Yen-Wen | Modularized electronic component cooling apparatus |
US5957659A (en) * | 1996-07-03 | 1999-09-28 | Matsushita Electric Industrial Co., Ltd. | Heat sink apparatus |
US5992511A (en) * | 1996-05-31 | 1999-11-30 | Sanyo Denki Co., Ltd. | Cooling apparatus for electronic element |
US6015008A (en) * | 1997-07-14 | 2000-01-18 | Mitsubishi Electric Home Appliance Co., Ltd. | Heat radiating plate |
US6125920A (en) * | 1997-10-16 | 2000-10-03 | Herbert; Edward | Fan with heat sink using stamped heat sink fins |
US6134108A (en) * | 1998-06-18 | 2000-10-17 | Hewlett-Packard Company | Apparatus and method for air-cooling an electronic assembly |
US6170563B1 (en) * | 1999-07-26 | 2001-01-09 | Hsieh Hsin-Mao | Heat radiating device for notebook computer |
US6196300B1 (en) * | 1997-07-31 | 2001-03-06 | Maurizio Checchetti | Heat sink |
US6199624B1 (en) * | 1999-04-30 | 2001-03-13 | Molex Incorporated | Folded fin heat sink and a heat exchanger employing the heat sink |
US6244331B1 (en) * | 1999-10-22 | 2001-06-12 | Intel Corporation | Heatsink with integrated blower for improved heat transfer |
US6313399B1 (en) * | 1997-11-21 | 2001-11-06 | Muuntolaite Oy | Cooling element for an unevenly distributed heat load |
US20010037876A1 (en) * | 2000-03-30 | 2001-11-08 | Basf Aktiengesellschaft | Use of the lotus effect in process engineering |
US20020020517A1 (en) * | 2000-08-15 | 2002-02-21 | Hsu Hul Chun | Geometrical streamline flow guiding and heat dissipating structure |
US6371200B1 (en) * | 1999-11-18 | 2002-04-16 | The United States Of America As Represented By The Secretary Of The Navy | Perforated heat sink |
US20020056543A1 (en) * | 1999-11-09 | 2002-05-16 | Geunbae Lim | Cooling device with micro cooling fin |
US20020079086A1 (en) * | 2000-12-27 | 2002-06-27 | Delta Electronics Inc. | Embedded centrifugal cooling device |
US6419007B1 (en) * | 2001-03-30 | 2002-07-16 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US20020100577A1 (en) * | 2001-01-31 | 2002-08-01 | Wagner Guy R. | Ductwork improves efficiency of counterflow two pass active heat sink |
US20020121365A1 (en) * | 2001-03-05 | 2002-09-05 | Kozyra Kazimierz L. | Radial folded fin heat sink |
US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
US6505680B1 (en) * | 2001-07-27 | 2003-01-14 | Hewlett-Packard Company | High performance cooling device |
US6525939B2 (en) * | 2000-08-08 | 2003-02-25 | Acer Inc. | Heat sink apparatus |
US20030046967A1 (en) * | 2001-09-10 | 2003-03-13 | Intel Corporation | Manufacturing process for a radial fin heat sink |
US6536385B1 (en) * | 1999-03-17 | 2003-03-25 | Sanshin Kogyo Kabushiki Kaisha | Piston ring |
US6543522B1 (en) * | 2001-10-31 | 2003-04-08 | Hewlett-Packard Development Company, L.P. | Arrayed fin cooler |
US6587341B1 (en) * | 2002-03-04 | 2003-07-01 | Chun Long Metal Co., Ltd. | Heat dissipater structure |
US6633484B1 (en) * | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US6657862B2 (en) * | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
US6659169B1 (en) * | 1999-12-09 | 2003-12-09 | Advanced Rotary Systems, Llc | Cooler for electronic devices |
US6664673B2 (en) * | 2001-08-27 | 2003-12-16 | Advanced Rotary Systems Llc | Cooler for electronic devices |
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US6714415B1 (en) * | 2003-03-13 | 2004-03-30 | Intel Corporation | Split fin heat sink |
US6736195B2 (en) * | 2000-06-15 | 2004-05-18 | Borgwarner Inc. | Cooling fin arrangement |
US6755242B2 (en) * | 2001-04-17 | 2004-06-29 | Hewlett-Packard Development Company, L.P. | Active heat sink structure with directed air flow |
US20050039899A1 (en) * | 2003-07-22 | 2005-02-24 | Viktor Brost | Turbulator for heat exchanger |
US20050077027A1 (en) * | 2003-08-30 | 2005-04-14 | Edward Lopatinsky | Cooler with blower comprising heat-exchanging elements |
US20060021735A1 (en) * | 2004-07-27 | 2006-02-02 | Industrial Design Laboratories Inc. | Integrated cooler for electronic devices |
US20060042777A1 (en) * | 2004-08-31 | 2006-03-02 | Delano Andrew D | Heat sink fin with stator blade |
US7044202B2 (en) * | 2001-06-27 | 2006-05-16 | Rotys Inc. | Cooler for electronic devices |
US20060187642A1 (en) * | 2005-02-22 | 2006-08-24 | Kwang-Jin Jeong | Structure for heat dissipation of integrated circuit chip and display module including the same |
US7147079B2 (en) * | 2002-12-23 | 2006-12-12 | Giat Industries | Device to prevent the formation of solid matter due to projections on an air outlet |
US7193849B2 (en) * | 2003-08-27 | 2007-03-20 | Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. | Heat dissipating device |
US20070210656A1 (en) * | 2005-02-02 | 2007-09-13 | Lafontaine Charles Y | Compact high power alternator |
US7361081B2 (en) * | 2004-07-23 | 2008-04-22 | Hewlett-Packard Development Company, L.P. | Small form factor air jet cooling system |
US20080175730A1 (en) * | 2007-01-24 | 2008-07-24 | Minebea Co., Ltd. | Cooling apparatus for an electronic device to be cooled |
US20080218972A1 (en) * | 2007-03-06 | 2008-09-11 | Ioan Sauciuc | Cooling device, system containing same, and cooling method |
US20090034197A1 (en) * | 2007-06-30 | 2009-02-05 | Javier Leija | Heatsink, method of manufacturing same, and microelectronic package containing same |
US20090139699A1 (en) * | 2007-11-30 | 2009-06-04 | Caterpillar Inc. | Annular intercooler having curved fins |
US20090145584A1 (en) * | 2005-11-17 | 2009-06-11 | University Of Limerick | Cooling Device |
US20090205807A1 (en) * | 2006-08-10 | 2009-08-20 | Korea Advanced Institute Of Science And Technology | Installation fins and installation structure of fins and a heat sink with moving fins inserted between cooling fins |
US20100108282A1 (en) * | 2007-06-15 | 2010-05-06 | Fredrik Ewalds | Press fabric |
US7760506B1 (en) * | 2007-06-06 | 2010-07-20 | Hewlett-Packard Development Company, L.P. | Electronic components, systems and apparatus with air flow devices |
US7814967B2 (en) * | 2002-01-03 | 2010-10-19 | New Pax, Inc. | Heat exchanger |
-
2009
- 2009-01-06 US US12/319,301 patent/US20100170657A1/en not_active Abandoned
Patent Citations (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592260A (en) * | 1969-12-05 | 1971-07-13 | Espey Mfg & Electronics Corp | Heat exchanger with inner guide strip |
US4838041A (en) * | 1987-02-05 | 1989-06-13 | Gte Laboratories Incorporated | Expansion/evaporation cooling system for microelectronic devices |
US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
US5224538A (en) * | 1991-11-01 | 1993-07-06 | Jacoby John H | Dimpled heat transfer surface and method of making same |
US5661638A (en) * | 1995-11-03 | 1997-08-26 | Silicon Graphics, Inc. | High performance spiral heat sink |
US5730213A (en) * | 1995-11-13 | 1998-03-24 | Alliedsignal, Inc. | Cooling tube for heat exchanger |
US5992511A (en) * | 1996-05-31 | 1999-11-30 | Sanyo Denki Co., Ltd. | Cooling apparatus for electronic element |
US5957659A (en) * | 1996-07-03 | 1999-09-28 | Matsushita Electric Industrial Co., Ltd. | Heat sink apparatus |
US5867365A (en) * | 1997-06-10 | 1999-02-02 | Chiou; Ming Chin | CPU heat sink assembly |
US6015008A (en) * | 1997-07-14 | 2000-01-18 | Mitsubishi Electric Home Appliance Co., Ltd. | Heat radiating plate |
US6196300B1 (en) * | 1997-07-31 | 2001-03-06 | Maurizio Checchetti | Heat sink |
US5943209A (en) * | 1997-10-06 | 1999-08-24 | Liu; Yen-Wen | Modularized electronic component cooling apparatus |
US6125920A (en) * | 1997-10-16 | 2000-10-03 | Herbert; Edward | Fan with heat sink using stamped heat sink fins |
US6313399B1 (en) * | 1997-11-21 | 2001-11-06 | Muuntolaite Oy | Cooling element for an unevenly distributed heat load |
US5927385A (en) * | 1998-01-21 | 1999-07-27 | Yeh; Ming Hsin | Cooling device for the CPU of computer |
US6134108A (en) * | 1998-06-18 | 2000-10-17 | Hewlett-Packard Company | Apparatus and method for air-cooling an electronic assembly |
US6536385B1 (en) * | 1999-03-17 | 2003-03-25 | Sanshin Kogyo Kabushiki Kaisha | Piston ring |
US6199624B1 (en) * | 1999-04-30 | 2001-03-13 | Molex Incorporated | Folded fin heat sink and a heat exchanger employing the heat sink |
US6170563B1 (en) * | 1999-07-26 | 2001-01-09 | Hsieh Hsin-Mao | Heat radiating device for notebook computer |
US6244331B1 (en) * | 1999-10-22 | 2001-06-12 | Intel Corporation | Heatsink with integrated blower for improved heat transfer |
US20020056543A1 (en) * | 1999-11-09 | 2002-05-16 | Geunbae Lim | Cooling device with micro cooling fin |
US6371200B1 (en) * | 1999-11-18 | 2002-04-16 | The United States Of America As Represented By The Secretary Of The Navy | Perforated heat sink |
US6659169B1 (en) * | 1999-12-09 | 2003-12-09 | Advanced Rotary Systems, Llc | Cooler for electronic devices |
US20010037876A1 (en) * | 2000-03-30 | 2001-11-08 | Basf Aktiengesellschaft | Use of the lotus effect in process engineering |
US6736195B2 (en) * | 2000-06-15 | 2004-05-18 | Borgwarner Inc. | Cooling fin arrangement |
US6525939B2 (en) * | 2000-08-08 | 2003-02-25 | Acer Inc. | Heat sink apparatus |
US20020020517A1 (en) * | 2000-08-15 | 2002-02-21 | Hsu Hul Chun | Geometrical streamline flow guiding and heat dissipating structure |
US6633484B1 (en) * | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US20020079086A1 (en) * | 2000-12-27 | 2002-06-27 | Delta Electronics Inc. | Embedded centrifugal cooling device |
US20020100577A1 (en) * | 2001-01-31 | 2002-08-01 | Wagner Guy R. | Ductwork improves efficiency of counterflow two pass active heat sink |
US20020121365A1 (en) * | 2001-03-05 | 2002-09-05 | Kozyra Kazimierz L. | Radial folded fin heat sink |
US6419007B1 (en) * | 2001-03-30 | 2002-07-16 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6755242B2 (en) * | 2001-04-17 | 2004-06-29 | Hewlett-Packard Development Company, L.P. | Active heat sink structure with directed air flow |
US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
US20020171139A1 (en) * | 2001-05-18 | 2002-11-21 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
US7044202B2 (en) * | 2001-06-27 | 2006-05-16 | Rotys Inc. | Cooler for electronic devices |
US6505680B1 (en) * | 2001-07-27 | 2003-01-14 | Hewlett-Packard Company | High performance cooling device |
US6664673B2 (en) * | 2001-08-27 | 2003-12-16 | Advanced Rotary Systems Llc | Cooler for electronic devices |
US20030046967A1 (en) * | 2001-09-10 | 2003-03-13 | Intel Corporation | Manufacturing process for a radial fin heat sink |
US7911790B2 (en) * | 2001-09-10 | 2011-03-22 | Intel Corporation | Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods |
US6657862B2 (en) * | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
US7200934B2 (en) * | 2001-09-10 | 2007-04-10 | Intel Corporation | Electronic assemblies with high capacity heat sinks and methods of manufacture |
US7120020B2 (en) * | 2001-09-10 | 2006-10-10 | Intel Corporation | Electronic assemblies with high capacity bent fin heat sinks |
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US6543522B1 (en) * | 2001-10-31 | 2003-04-08 | Hewlett-Packard Development Company, L.P. | Arrayed fin cooler |
US7814967B2 (en) * | 2002-01-03 | 2010-10-19 | New Pax, Inc. | Heat exchanger |
US6587341B1 (en) * | 2002-03-04 | 2003-07-01 | Chun Long Metal Co., Ltd. | Heat dissipater structure |
US7147079B2 (en) * | 2002-12-23 | 2006-12-12 | Giat Industries | Device to prevent the formation of solid matter due to projections on an air outlet |
US7188418B2 (en) * | 2003-03-13 | 2007-03-13 | Intel Corporation | Method of making split fin heat sink |
US6714415B1 (en) * | 2003-03-13 | 2004-03-30 | Intel Corporation | Split fin heat sink |
US20050039899A1 (en) * | 2003-07-22 | 2005-02-24 | Viktor Brost | Turbulator for heat exchanger |
US7193849B2 (en) * | 2003-08-27 | 2007-03-20 | Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. | Heat dissipating device |
US20050077027A1 (en) * | 2003-08-30 | 2005-04-14 | Edward Lopatinsky | Cooler with blower comprising heat-exchanging elements |
US7361081B2 (en) * | 2004-07-23 | 2008-04-22 | Hewlett-Packard Development Company, L.P. | Small form factor air jet cooling system |
US20060021735A1 (en) * | 2004-07-27 | 2006-02-02 | Industrial Design Laboratories Inc. | Integrated cooler for electronic devices |
US20060042777A1 (en) * | 2004-08-31 | 2006-03-02 | Delano Andrew D | Heat sink fin with stator blade |
US20070210656A1 (en) * | 2005-02-02 | 2007-09-13 | Lafontaine Charles Y | Compact high power alternator |
US20060187642A1 (en) * | 2005-02-22 | 2006-08-24 | Kwang-Jin Jeong | Structure for heat dissipation of integrated circuit chip and display module including the same |
US20090145584A1 (en) * | 2005-11-17 | 2009-06-11 | University Of Limerick | Cooling Device |
US20090205807A1 (en) * | 2006-08-10 | 2009-08-20 | Korea Advanced Institute Of Science And Technology | Installation fins and installation structure of fins and a heat sink with moving fins inserted between cooling fins |
US20080175730A1 (en) * | 2007-01-24 | 2008-07-24 | Minebea Co., Ltd. | Cooling apparatus for an electronic device to be cooled |
US20080218972A1 (en) * | 2007-03-06 | 2008-09-11 | Ioan Sauciuc | Cooling device, system containing same, and cooling method |
US7760506B1 (en) * | 2007-06-06 | 2010-07-20 | Hewlett-Packard Development Company, L.P. | Electronic components, systems and apparatus with air flow devices |
US20100108282A1 (en) * | 2007-06-15 | 2010-05-06 | Fredrik Ewalds | Press fabric |
US20090034197A1 (en) * | 2007-06-30 | 2009-02-05 | Javier Leija | Heatsink, method of manufacturing same, and microelectronic package containing same |
US7692922B2 (en) * | 2007-06-30 | 2010-04-06 | Intel Corporation | Heatsink, method of manufacturing same, and microelectronic package containing same |
US20090139699A1 (en) * | 2007-11-30 | 2009-06-04 | Caterpillar Inc. | Annular intercooler having curved fins |
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
US20120313980A1 (en) * | 2009-12-21 | 2012-12-13 | Martin Professional A/S | Cooling Module For Multiple Light Source Projecting Device |
US8888294B2 (en) * | 2009-12-21 | 2014-11-18 | Martin Professional Aps | Cooling module for multiple light source projecting device |
US8243451B2 (en) * | 2010-06-08 | 2012-08-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling member for heat containing device |
US20110299244A1 (en) * | 2010-06-08 | 2011-12-08 | Toyota Motor Engineering & Manufacturing | Cooling member for heat containing device |
US8295046B2 (en) | 2010-07-19 | 2012-10-23 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
US8331091B2 (en) | 2010-09-01 | 2012-12-11 | Hamilton Sundstrand Corporation | Electronics package with radial heat sink and integrated blower |
US20120055653A1 (en) * | 2010-09-03 | 2012-03-08 | Wistron Corporation | Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
US10139095B2 (en) | 2012-05-04 | 2018-11-27 | GE Lighting Solutions, LLC | Reflector and lamp comprised thereof |
US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
WO2014092881A1 (en) * | 2012-12-11 | 2014-06-19 | GE Lighting Solutions, LLC | Active cooling device |
US10104808B2 (en) * | 2014-05-23 | 2018-10-16 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
US20150342091A1 (en) * | 2014-05-23 | 2015-11-26 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
DE102015209375B4 (en) | 2014-05-23 | 2021-09-16 | Fronius International Gmbh | Cooling device and inverter housing with such a cooling device |
GB2528161A (en) * | 2014-07-09 | 2016-01-13 | Hamilton Sundstrand Corp | Integrated blower diffuser-fin single phase heat exchanger |
GB2528161B (en) * | 2014-07-09 | 2020-04-29 | Hamilton Sundstrand Corp | Integrated blower diffuser-fin single phase heat exchanger |
US10986750B2 (en) * | 2014-08-25 | 2021-04-20 | Hamilton Sundstrand Corporation | Heat exchange device in directed flow system |
EP2991107A3 (en) * | 2014-08-25 | 2016-04-20 | Hamilton Sundstrand Corporation | Heat exchanger device in directed flow system |
US20160057890A1 (en) * | 2014-08-25 | 2016-02-25 | Hamilton Sundstrand Corporation | Heat exchange device in directed flow system |
US10506735B2 (en) * | 2014-08-25 | 2019-12-10 | Hamilton Sundstrand Corporation | Heat exchange device in directed flow system |
US11098953B2 (en) | 2015-04-10 | 2021-08-24 | Carrier Corporation | Integrated fan heat exchanger |
US10222102B2 (en) | 2015-10-21 | 2019-03-05 | Ami Industries, Inc. | Thermoelectric based heat pump configuration |
US11107749B2 (en) * | 2018-02-26 | 2021-08-31 | Toyota Jidosha Kabushiki Kaisha | Heat dissipation fin structure and cooling structure for electric substrate using the same |
US20190267308A1 (en) * | 2018-02-26 | 2019-08-29 | Toyota Jidosha Kabushiki Kaisha | Heat dissipation fin structure and cooling structure for electric substrate using the same |
US10890387B2 (en) * | 2018-10-25 | 2021-01-12 | United Arab Emirates University | Heat sinks with vibration enhanced heat transfer |
US10866038B2 (en) * | 2018-10-25 | 2020-12-15 | United Arab Emirates University | Heat sinks with vibration enhanced heat transfer for non-liquid heat sources |
US10998253B1 (en) | 2019-12-23 | 2021-05-04 | Google Llc | Fluid diverting heat sink |
US11039550B1 (en) | 2020-04-08 | 2021-06-15 | Google Llc | Heat sink with turbulent structures |
US11574850B2 (en) | 2020-04-08 | 2023-02-07 | Google Llc | Heat sink with turbulent structures |
US11270925B2 (en) | 2020-05-28 | 2022-03-08 | Google Llc | Heat distribution device with flow channels |
US11955400B2 (en) | 2020-05-28 | 2024-04-09 | Google Llc | Heat distribution device with flow channels |
US20220252359A1 (en) * | 2021-02-09 | 2022-08-11 | Raytheon Technologies Corporation | Three-dimensional diffuser-fin heat sink with integrated blower |
US11686536B2 (en) * | 2021-02-09 | 2023-06-27 | Raytheon Technologies Corporation | Three-dimensional diffuser-fin heat sink with integrated blower |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100170657A1 (en) | Integrated blower diffuser-fin heat sink | |
US7167364B2 (en) | Cooler with blower between two heatsinks | |
US7021894B2 (en) | Apparatus for cooling of electronic components | |
US6664673B2 (en) | Cooler for electronic devices | |
US20060021735A1 (en) | Integrated cooler for electronic devices | |
US7071587B2 (en) | Integrated cooler for electronic devices | |
US7173353B2 (en) | Integrated blower for cooling device | |
US20080101966A1 (en) | High efficient compact radial blower | |
US7976291B2 (en) | Motor cooler | |
US8087905B2 (en) | Cooling apparatus for an electronic device to be cooled | |
US6698505B2 (en) | Cooler for an electronic device | |
US5794687A (en) | Forced air cooling apparatus for semiconductor chips | |
US6923619B2 (en) | Integrated blade cooler for electronic components | |
US6653755B2 (en) | Radial air flow fan assembly having stator fins surrounding rotor blades | |
US20080164011A1 (en) | Liquid cooling type heat-dissipating device | |
JP2005311343A (en) | Cooling apparatus for heat-generating devices | |
US7044202B2 (en) | Cooler for electronic devices | |
US10222102B2 (en) | Thermoelectric based heat pump configuration | |
US7237599B2 (en) | Cooler with blower comprising heat-exchanging elements | |
JP3458527B2 (en) | Heat sink device | |
JPH08195456A (en) | Cooler for electronic apparatus | |
US10186936B2 (en) | Electric machine with a baffle | |
TW201120320A (en) | Fan module and heat disspation device incorporating the same | |
US10986750B2 (en) | Heat exchange device in directed flow system | |
KR100945052B1 (en) | Heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: UNITED TECHNOLOGIES CORPORATION, CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KASLUSKY, SCOTT F.;REEL/FRAME:022121/0831 Effective date: 20090106 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |