WO1997032314A3 - Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof - Google Patents

Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof Download PDF

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Publication number
WO1997032314A3
WO1997032314A3 PCT/US1997/001570 US9701570W WO9732314A3 WO 1997032314 A3 WO1997032314 A3 WO 1997032314A3 US 9701570 W US9701570 W US 9701570W WO 9732314 A3 WO9732314 A3 WO 9732314A3
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric properties
laminates
substrate material
thermoplastic elastomeric
elastomeric substrate
Prior art date
Application number
PCT/US1997/001570
Other languages
French (fr)
Other versions
WO1997032314A2 (en
Inventor
Joan V Brennan
Scott T Ginkel
Timothy S Skogland
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Priority to EP97904139A priority Critical patent/EP0883880A2/en
Priority to JP9530950A priority patent/JP2000506305A/en
Priority to AU18511/97A priority patent/AU1851197A/en
Priority to BR9707761A priority patent/BR9707761A/en
Publication of WO1997032314A2 publication Critical patent/WO1997032314A2/en
Publication of WO1997032314A3 publication Critical patent/WO1997032314A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Abstract

A thermoplastic elastomer which may be formulated to have a wide range of dielectric properties as required for a particular application. The material of the invention is preferably provided in the form of a film, which may be bonded to metallic layers, additional dielectric layers, or other circuit structures to form a laminate structure with the desired dielectric properties.
PCT/US1997/001570 1996-02-29 1997-01-29 Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof WO1997032314A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP97904139A EP0883880A2 (en) 1996-02-29 1997-01-29 Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof
JP9530950A JP2000506305A (en) 1996-02-29 1997-01-29 Thermoplastic elastomer substrate material with tunable dielectric properties and laminates thereof
AU18511/97A AU1851197A (en) 1996-02-29 1997-01-29 Thermoplastic elastomeric substrate material with tunable dielectric properti es and laminates thereof
BR9707761A BR9707761A (en) 1996-02-29 1997-01-29 Dielectric material laminated structure and processes for adjusting the dielectric properties of a dielectric material and for preparing a dielectric laminate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60877996A 1996-02-29 1996-02-29
US08/608,779 1996-02-29

Publications (2)

Publication Number Publication Date
WO1997032314A2 WO1997032314A2 (en) 1997-09-04
WO1997032314A3 true WO1997032314A3 (en) 1997-12-04

Family

ID=24437960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/001570 WO1997032314A2 (en) 1996-02-29 1997-01-29 Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof

Country Status (7)

Country Link
EP (1) EP0883880A2 (en)
JP (1) JP2000506305A (en)
KR (1) KR19990087365A (en)
AU (1) AU1851197A (en)
BR (1) BR9707761A (en)
CA (1) CA2247477A1 (en)
WO (1) WO1997032314A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19917477A1 (en) * 1998-08-25 2000-03-02 Cellpack Ag Wohlen Insulating materials
JP2001094264A (en) * 1999-09-22 2001-04-06 Ibiden Co Ltd Multilayer printed wiring board and manufacturing method
US6562448B1 (en) 2000-04-06 2003-05-13 3M Innovative Properties Company Low density dielectric having low microwave loss
JP3700617B2 (en) * 2001-07-04 2005-09-28 株式会社村田製作所 Lens antenna
JP3767606B2 (en) 2004-02-25 2006-04-19 株式会社村田製作所 Dielectric antenna
JP4777680B2 (en) * 2005-04-06 2011-09-21 Ｎｔｎ株式会社 High dielectric elastomer composition
JP5362205B2 (en) 2007-04-24 2013-12-11 Ｎｔｎ株式会社 High frequency electronic component materials
WO2008133130A1 (en) * 2007-04-24 2008-11-06 Ntn Corporation Highly dielectric elastomer molded body and electronic component material for high frequency use
WO2009056154A1 (en) * 2007-10-30 2009-05-07 Pirelli & C. S.P.A. Dielectric resonator
KR101035259B1 (en) * 2009-09-15 2011-05-18 이소영 Fluororesin polymer electret and process for producing the same
US9972421B2 (en) * 2010-05-12 2018-05-15 Nexans FEP modification to reduce skew in data communications cables
US8835765B2 (en) 2010-07-30 2014-09-16 Nexans FEP modification using titanium dioxide to reduce skew in data communications cables
JP6088888B2 (en) * 2013-03-29 2017-03-01 出光ユニテック株式会社 Container body, container, packaging container, sealing method, and container body manufacturing method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2090713A5 (en) * 1970-04-27 1972-01-14 Basf Ag Thermoplastic compsn with high dielectric constant
FR2594193A1 (en) * 1986-02-07 1987-08-14 Bridgestone Corp ANTISISMIC SUPPORT AND ASSEMBLY OF ANTISISMIC SUPPORTS
EP0243161A2 (en) * 1986-04-22 1987-10-28 The Yokohama Rubber Co., Ltd. Microwave-absorptive composite
GB2224464A (en) * 1988-08-25 1990-05-09 Yokohama Rubber Co Ltd Printed wiring board
EP0382557A1 (en) * 1989-02-10 1990-08-16 Junkosha Co. Ltd. Dielectric material
EP0398672A1 (en) * 1989-05-17 1990-11-22 Minnesota Mining And Manufacturing Company Microwave absorber for direct surface application
US5223568A (en) * 1987-05-14 1993-06-29 Rogers Corporation Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles
JPH08258207A (en) * 1995-03-24 1996-10-08 Bridgestone Corp Laminated structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2090713A5 (en) * 1970-04-27 1972-01-14 Basf Ag Thermoplastic compsn with high dielectric constant
FR2594193A1 (en) * 1986-02-07 1987-08-14 Bridgestone Corp ANTISISMIC SUPPORT AND ASSEMBLY OF ANTISISMIC SUPPORTS
EP0243161A2 (en) * 1986-04-22 1987-10-28 The Yokohama Rubber Co., Ltd. Microwave-absorptive composite
US5223568A (en) * 1987-05-14 1993-06-29 Rogers Corporation Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles
GB2224464A (en) * 1988-08-25 1990-05-09 Yokohama Rubber Co Ltd Printed wiring board
EP0382557A1 (en) * 1989-02-10 1990-08-16 Junkosha Co. Ltd. Dielectric material
EP0398672A1 (en) * 1989-05-17 1990-11-22 Minnesota Mining And Manufacturing Company Microwave absorber for direct surface application
JPH08258207A (en) * 1995-03-24 1996-10-08 Bridgestone Corp Laminated structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 097, no. 002 28 February 1997 (1997-02-28) *

Also Published As

Publication number Publication date
BR9707761A (en) 1999-07-27
WO1997032314A2 (en) 1997-09-04
KR19990087365A (en) 1999-12-27
CA2247477A1 (en) 1997-09-04
EP0883880A2 (en) 1998-12-16
JP2000506305A (en) 2000-05-23
AU1851197A (en) 1997-09-16

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