WO2009035849A3 - Semiconductor die mount by conformal die coating - Google Patents

Semiconductor die mount by conformal die coating Download PDF

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Publication number
WO2009035849A3
WO2009035849A3 PCT/US2008/074450 US2008074450W WO2009035849A3 WO 2009035849 A3 WO2009035849 A3 WO 2009035849A3 US 2008074450 W US2008074450 W US 2008074450W WO 2009035849 A3 WO2009035849 A3 WO 2009035849A3
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WO
WIPO (PCT)
Prior art keywords
die
support
coating
conformal
conformal coating
Prior art date
Application number
PCT/US2008/074450
Other languages
French (fr)
Other versions
WO2009035849A2 (en
Inventor
Scott Jay Crane
Simon J S Mcelrea
Scott Mcgrath
Weiping Pan
De Ann Eileen Melcher
Marc E Robinson
Original Assignee
Vertical Circuits Inc
Scott Jay Crane
Simon J S Mcelrea
Scott Mcgrath
Weiping Pan
De Ann Eileen Melcher
Marc E Robinson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vertical Circuits Inc, Scott Jay Crane, Simon J S Mcelrea, Scott Mcgrath, Weiping Pan, De Ann Eileen Melcher, Marc E Robinson filed Critical Vertical Circuits Inc
Publication of WO2009035849A2 publication Critical patent/WO2009035849A2/en
Publication of WO2009035849A3 publication Critical patent/WO2009035849A3/en

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01—Chemical elements
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
PCT/US2008/074450 2007-09-10 2008-08-27 Semiconductor die mount by conformal die coating WO2009035849A2 (en)

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US60/971,203 2007-09-10

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US8704379B2 (en) 2014-04-22
US20090065916A1 (en) 2009-03-12
TW200931605A (en) 2009-07-16
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US20160104689A1 (en) 2016-04-14
US9824999B2 (en) 2017-11-21

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