WO2009059007A3 - Additives for improved adhesion to oily substrates - Google Patents

Additives for improved adhesion to oily substrates Download PDF

Info

Publication number
WO2009059007A3
WO2009059007A3 PCT/US2008/081792 US2008081792W WO2009059007A3 WO 2009059007 A3 WO2009059007 A3 WO 2009059007A3 US 2008081792 W US2008081792 W US 2008081792W WO 2009059007 A3 WO2009059007 A3 WO 2009059007A3
Authority
WO
WIPO (PCT)
Prior art keywords
improving additive
adhesion improving
oily
adhesion
adhesive
Prior art date
Application number
PCT/US2008/081792
Other languages
French (fr)
Other versions
WO2009059007A2 (en
Inventor
Mark W Pressley
Kirk J Abbey
Sandra L Case
Original Assignee
Lord Corp
Mark W Pressley
Kirk J Abbey
Sandra L Case
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lord Corp, Mark W Pressley, Kirk J Abbey, Sandra L Case filed Critical Lord Corp
Priority to BRPI0819357 priority Critical patent/BRPI0819357A2/en
Priority to EP08845204A priority patent/EP2205691A2/en
Priority to JP2010532241A priority patent/JP2011502206A/en
Priority to CN200880114291A priority patent/CN101842454A/en
Publication of WO2009059007A2 publication Critical patent/WO2009059007A2/en
Publication of WO2009059007A3 publication Critical patent/WO2009059007A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate

Abstract

An adhesive composition is provided which is capable of bonding to metallic surfaces which are contaminated with oil or oily residue. An adhesion improving additive is added to the base adhesive/coating composition which enables the adhesive to achieve better bonding to oily substrates. Addition of the adhesion improving additive improves the adhesion of adhesives, sealants, and coatings to the oily substrates used in the automotive and industrial markets. The an adhesion improving additive is an aliphatic molecule of at least 8 carbon atoms or having an aliphatic end group or side chain of least 6 carbon atoms, and wherein the adhesion improving additive comprises a boiling point of at least 30 °C.
PCT/US2008/081792 2007-10-31 2008-10-30 Additives for improved adhesion to oily substrates WO2009059007A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BRPI0819357 BRPI0819357A2 (en) 2007-10-31 2008-10-30 Additives to improve adhesion to oily substrates
EP08845204A EP2205691A2 (en) 2007-10-31 2008-10-30 Additives for improved adhesion to oily substrates
JP2010532241A JP2011502206A (en) 2007-10-31 2008-10-30 Additives for improving adhesion to oily substrates
CN200880114291A CN101842454A (en) 2007-10-31 2008-10-30 Be used to improve fusible additive with the oiliness substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98394707P 2007-10-31 2007-10-31
US60/983,947 2007-10-31

Publications (2)

Publication Number Publication Date
WO2009059007A2 WO2009059007A2 (en) 2009-05-07
WO2009059007A3 true WO2009059007A3 (en) 2009-06-18

Family

ID=40565244

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/081792 WO2009059007A2 (en) 2007-10-31 2008-10-30 Additives for improved adhesion to oily substrates

Country Status (7)

Country Link
US (1) US20090110835A1 (en)
EP (1) EP2205691A2 (en)
JP (1) JP2011502206A (en)
KR (1) KR20100091194A (en)
CN (1) CN101842454A (en)
BR (1) BRPI0819357A2 (en)
WO (1) WO2009059007A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2475731B1 (en) 2009-09-11 2018-09-19 3M Innovative Properties Company Curable and cured adhesive compositions
JP5530524B2 (en) 2009-09-11 2014-06-25 スリーエム イノベイティブ プロパティズ カンパニー Curable and cured adhesive composition
US9290683B2 (en) 2010-11-12 2016-03-22 3M Innovative Properties Company Curable and cured compositions
CN103221450B (en) 2010-11-12 2016-01-20 3M创新有限公司 Curable compositions
US20130260042A1 (en) 2010-12-22 2013-10-03 Christopher J. Campbell Epoxy-based coating compositions
WO2012134735A1 (en) * 2011-03-25 2012-10-04 Huntsman Advanced Materials Americas Llc Peroxide-free methacrylate structural adhesives
US8945338B2 (en) * 2013-03-15 2015-02-03 Henkel US IP LLC Anaerobic curable compositions

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629380A (en) * 1994-09-19 1997-05-13 Minnesota Mining And Manufacturing Company Epoxy adhesive composition comprising a calcium salt and mannich base
WO1997021735A1 (en) * 1995-12-11 1997-06-19 Lord Corporation Modified polyalkadiene-containing compositions
EP1655346A1 (en) * 2003-08-13 2006-05-10 Sunstar Giken Kabushiki Kaisha Two-part curable composition
US20060264573A1 (en) * 2005-05-19 2006-11-23 Bennett Ruth M Ambient curable protective sealant

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
US3497466A (en) * 1967-12-15 1970-02-24 Technical Coatings Co Adhesive concentrate for improving adhesion of coating compositions to base coated metal substrates,and cans or can components coated therewith
JPS56152765A (en) * 1980-04-30 1981-11-26 Kansai Paint Co Ltd Formation of olefin resin coating film
JPS5834878A (en) * 1981-08-25 1983-03-01 Sanyo Chem Ind Ltd Hot-melt type pressure-sensitive adhesive
US5210121A (en) * 1983-08-18 1993-05-11 The Permethyl Corporation Hydrophobic and/or abhesive materials, reactive diluents, and reactive plasticizers
US4940846A (en) * 1983-08-18 1990-07-10 Rudolf Hinterwaldner Hydrophobic and/or abhesive materials, reactive diluents
DE3329877A1 (en) * 1983-08-18 1985-03-07 Rudolf 8000 München Hinterwaldner HYDROPHOBIC AND / OR ABHAESIVE MATERIAL, REACTIVE THINNERS AND SOFTENERS AND THEIR USE
DE3400860A1 (en) * 1984-01-12 1985-07-18 Henkel KGaA, 4000 Düsseldorf GLASS PRIMER
US4849468A (en) * 1985-06-19 1989-07-18 Toyoda Gosei Co., Ltd. Adhesive compositions
US4695508A (en) * 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition
DE4340834A1 (en) * 1993-03-15 1994-09-22 Siemens Ag Phosphorus-modified epoxy resins, process for their preparation, and their use
HUP0004603A2 (en) * 1997-10-17 2001-04-28 The Dow Chemical Company Compositions of interpolymers of alpha-olefin monomers with one or more vinyl or vinylidene aromatic monomers and/or one or more hindered aliphatic or cycloaliphatic vinyl or vinylidene monomers and mixtures containing conductive additives
EP1275670B1 (en) * 2000-01-21 2005-08-10 Mitsui Chemicals, Inc. Olefin block copolymers, production processes of the same and use thereof
US6660326B2 (en) * 2000-08-04 2003-12-09 Tomoegawa Paper Co. Ltd. Production method for monolayer powder film and production apparatus therefor
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KR20080031734A (en) * 2005-06-24 2008-04-10 엑손모빌 케미칼 패턴츠 인코포레이티드 Functionalized propylene copolymer adhesive composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629380A (en) * 1994-09-19 1997-05-13 Minnesota Mining And Manufacturing Company Epoxy adhesive composition comprising a calcium salt and mannich base
WO1997021735A1 (en) * 1995-12-11 1997-06-19 Lord Corporation Modified polyalkadiene-containing compositions
EP1655346A1 (en) * 2003-08-13 2006-05-10 Sunstar Giken Kabushiki Kaisha Two-part curable composition
US20060264573A1 (en) * 2005-05-19 2006-11-23 Bennett Ruth M Ambient curable protective sealant

Also Published As

Publication number Publication date
WO2009059007A2 (en) 2009-05-07
US20090110835A1 (en) 2009-04-30
EP2205691A2 (en) 2010-07-14
BRPI0819357A2 (en) 2015-04-22
KR20100091194A (en) 2010-08-18
CN101842454A (en) 2010-09-22
JP2011502206A (en) 2011-01-20

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