WO2013012587A3 - Semiconductor package resin composition and usage method thereof - Google Patents
Semiconductor package resin composition and usage method thereof Download PDFInfo
- Publication number
- WO2013012587A3 WO2013012587A3 PCT/US2012/045916 US2012045916W WO2013012587A3 WO 2013012587 A3 WO2013012587 A3 WO 2013012587A3 US 2012045916 W US2012045916 W US 2012045916W WO 2013012587 A3 WO2013012587 A3 WO 2013012587A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- semiconductor package
- package resin
- usage method
- silane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014520234A JP6155261B2 (en) | 2011-07-15 | 2012-07-09 | Semiconductor package resin composition and method of using the same |
US14/131,827 US9230873B2 (en) | 2011-07-15 | 2012-07-09 | Semiconductor package resin composition and usage method thereof |
KR1020147003608A KR20140058557A (en) | 2011-07-15 | 2012-07-09 | Semiconductor package resin composition and usage method thereof |
US14/810,631 US9773714B2 (en) | 2011-07-15 | 2015-07-28 | Semiconductor package resin composition and usage method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161508344P | 2011-07-15 | 2011-07-15 | |
US61/508,344 | 2011-07-15 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/131,827 A-371-Of-International US9230873B2 (en) | 2011-07-15 | 2012-07-09 | Semiconductor package resin composition and usage method thereof |
US14/810,631 Continuation US9773714B2 (en) | 2011-07-15 | 2015-07-28 | Semiconductor package resin composition and usage method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013012587A2 WO2013012587A2 (en) | 2013-01-24 |
WO2013012587A3 true WO2013012587A3 (en) | 2013-04-18 |
Family
ID=47558664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/045916 WO2013012587A2 (en) | 2011-07-15 | 2012-07-09 | Semiconductor package resin composition and usage method thereof |
Country Status (5)
Country | Link |
---|---|
US (2) | US9230873B2 (en) |
JP (2) | JP6155261B2 (en) |
KR (1) | KR20140058557A (en) |
TW (1) | TWI550018B (en) |
WO (1) | WO2013012587A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103562317A (en) * | 2011-03-28 | 2014-02-05 | 3M创新有限公司 | Curable composition, article, method of curing, and reaction product |
JP6271164B2 (en) * | 2013-06-17 | 2018-01-31 | 日立オートモティブシステムズ株式会社 | Box-type in-vehicle controller |
WO2015102978A1 (en) * | 2014-01-02 | 2015-07-09 | Henkel IP & Holding GmbH | Film containing nano-particulate filler |
US9220183B1 (en) * | 2014-07-16 | 2015-12-22 | International Business Machines Corporation | Devices employing semiconductor die having hydrophobic coatings, and related cooling methods |
JP6872313B2 (en) * | 2015-10-13 | 2021-05-19 | リンテック株式会社 | Semiconductor devices and composite sheets |
US20190031790A1 (en) * | 2016-01-12 | 2019-01-31 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring board |
JP7454906B2 (en) * | 2016-10-14 | 2024-03-25 | 株式会社レゾナック | Underfill material, electronic component device, and method for manufacturing electronic component device |
US20210376203A1 (en) * | 2018-02-19 | 2021-12-02 | Signify Holding B.V. | Sealed device with light engine |
JP7109940B2 (en) * | 2018-03-08 | 2022-08-01 | 日東電工株式会社 | Sealing adhesive sheet |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030129421A1 (en) * | 2001-10-09 | 2003-07-10 | Mitsubishi Chemical Corporation | Active energy ray-curable antistatic coating composition |
EP1595919A1 (en) * | 2004-05-13 | 2005-11-16 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
JP2008297373A (en) * | 2007-05-29 | 2008-12-11 | Somar Corp | Underfill material comprising liquid epoxy resin composition, and flip chip type semiconductor device |
US20090140284A1 (en) * | 2005-10-28 | 2009-06-04 | Sumitomo Osaka Cement Co., Ltd. | Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin |
KR20100098320A (en) * | 2009-02-27 | 2010-09-06 | 주식회사 엘지화학 | Coating composition and coating film having enhanced abrasion resistance and contamination resistance |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6228681B1 (en) | 1999-03-10 | 2001-05-08 | Fry's Metals, Inc. | Flip chip having integral mask and underfill providing two-stage bump formation |
US6245595B1 (en) | 1999-07-22 | 2001-06-12 | National Semiconductor Corporation | Techniques for wafer level molding of underfill encapsulant |
US6281046B1 (en) | 2000-04-25 | 2001-08-28 | Atmel Corporation | Method of forming an integrated circuit package at a wafer level |
US6573122B2 (en) | 2001-03-28 | 2003-06-03 | International Rectifier Corporation | Wafer level insulation underfill for die attach |
US6794761B2 (en) | 2001-04-26 | 2004-09-21 | Intel Corporation | No-flow underfill material |
US20030111519A1 (en) | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US20030162911A1 (en) | 2002-01-31 | 2003-08-28 | Yue Xiao | No flow underfill composition |
US20060194064A1 (en) | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
US20040101688A1 (en) | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
US7022410B2 (en) | 2003-12-16 | 2006-04-04 | General Electric Company | Combinations of resin compositions and methods of use thereof |
JP2008180992A (en) * | 2007-01-25 | 2008-08-07 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive film for permanent resist, resist pattern forming method, printed wiring board and semiconductor package |
CN101657891A (en) | 2007-03-13 | 2010-02-24 | 洛德公司 | Convex die attachment method |
JP5004351B2 (en) | 2007-11-30 | 2012-08-22 | 信越化学工業株式会社 | Manufacturing method of semiconductor device |
BRPI1014911A2 (en) * | 2009-05-26 | 2016-07-26 | 3M Innovative Proferties Company | process for manufacturing loaded resins |
-
2012
- 2012-07-09 KR KR1020147003608A patent/KR20140058557A/en not_active Application Discontinuation
- 2012-07-09 JP JP2014520234A patent/JP6155261B2/en not_active Expired - Fee Related
- 2012-07-09 WO PCT/US2012/045916 patent/WO2013012587A2/en active Application Filing
- 2012-07-09 US US14/131,827 patent/US9230873B2/en not_active Expired - Fee Related
- 2012-07-13 TW TW101125423A patent/TWI550018B/en not_active IP Right Cessation
-
2015
- 2015-07-28 US US14/810,631 patent/US9773714B2/en not_active Expired - Fee Related
-
2017
- 2017-03-08 JP JP2017043422A patent/JP2017133023A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030129421A1 (en) * | 2001-10-09 | 2003-07-10 | Mitsubishi Chemical Corporation | Active energy ray-curable antistatic coating composition |
US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
EP1595919A1 (en) * | 2004-05-13 | 2005-11-16 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
US20090140284A1 (en) * | 2005-10-28 | 2009-06-04 | Sumitomo Osaka Cement Co., Ltd. | Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin |
JP2008297373A (en) * | 2007-05-29 | 2008-12-11 | Somar Corp | Underfill material comprising liquid epoxy resin composition, and flip chip type semiconductor device |
KR20100098320A (en) * | 2009-02-27 | 2010-09-06 | 주식회사 엘지화학 | Coating composition and coating film having enhanced abrasion resistance and contamination resistance |
Also Published As
Publication number | Publication date |
---|---|
JP6155261B2 (en) | 2017-06-28 |
US20140217622A1 (en) | 2014-08-07 |
KR20140058557A (en) | 2014-05-14 |
JP2014524957A (en) | 2014-09-25 |
TW201311806A (en) | 2013-03-16 |
US9773714B2 (en) | 2017-09-26 |
US9230873B2 (en) | 2016-01-05 |
TWI550018B (en) | 2016-09-21 |
JP2017133023A (en) | 2017-08-03 |
US20150329740A1 (en) | 2015-11-19 |
WO2013012587A2 (en) | 2013-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013012587A3 (en) | Semiconductor package resin composition and usage method thereof | |
TWI560225B (en) | Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate | |
EP2730603A4 (en) | Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconductor | |
EP3441385A4 (en) | Amine compound, amine composition, and epoxy resin curing agent | |
EP2410001A4 (en) | Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor | |
SG10201506094PA (en) | Functional Particle, Functional Particle Group, Filler, Resin Composition for Electronic Component, Electronic Component and Semiconductor Device | |
EP2392603A4 (en) | Epoxy resin composition, curing agent, and curing accelerator | |
EP2857457A4 (en) | Curable resin composition, and cured product, sealing agent, and optical semiconductor device using same | |
EP2581417A4 (en) | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition | |
WO2012026757A3 (en) | Phosphor film, method for manufacturing same, method for depositing a phosphor layer, method for manufacturing a light-emitting device package, and light-emitting device package | |
EP2653922A4 (en) | Positive photoresist composition, coating film thereof, and novolac phenol resin | |
WO2013086348A3 (en) | Adhesive material | |
CL2013001035A1 (en) | Aqueous coating compositions comprising an aqueous vehicle, a resin component and one or more clay anti-slip agents; coating system; coated article; and method of coating a surface. | |
EP2604639A4 (en) | Resin composition, cured resin product, wiring board, and manufacturing method for wiring board | |
MY185884A (en) | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | |
SG11201501594UA (en) | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition | |
EP2669310A4 (en) | Epoxy resin, curable resin composition and cured product thereof, and printed wiring substrate | |
MY176228A (en) | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | |
HK1177945A1 (en) | Heat-curable powder coating compositions, which after the coating has cured result in a matt surface and simple method for producing same | |
EP2754692A4 (en) | Resin particle aggregate, method for manufacturing same and application of same | |
PH12014501165A1 (en) | Resin composition, resin composition sheet, semiconductor device and method for manufacturing same | |
MY155689A (en) | Resin composition for encapsulating semiconductor and semiconductor device | |
EP2784808B8 (en) | Electrical component resin, semiconductor device, and substrate | |
WO2013012252A3 (en) | Composition having superior fingerprint resistance for glare prevention coating and glare prevention film manufactured using same | |
SG11201502291VA (en) | Resin composition, cured film, laminated film, and method for manufacturing semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12815036 Country of ref document: EP Kind code of ref document: A2 |
|
ENP | Entry into the national phase |
Ref document number: 2014520234 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20147003608 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14131827 Country of ref document: US |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12815036 Country of ref document: EP Kind code of ref document: A2 |