WO2014126960A2

WO2014126960A2 - Durable card

Info

Publication number: WO2014126960A2
Application number: PCT/US2014/015939
Authority: WO
Inventors: John Herslow
Original assignee: Composecure, Llc
Priority date: 2013-02-13
Filing date: 2014-02-12
Publication date: 2014-08-21
Also published as: US20140224881A1; WO2014126960A3; EP3345771A3; US11915074B2; EP3345771B1; EP2956310B1; EP3345771A2; US20190332907A1; US20170300790A1; ES2750216T3; US10311346B2; EP2956310A4; PL2956310T3; US10395153B2; EP2956310A2; DK2956310T3

Abstract

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

Description

DURABLE CARD

BACKGROUND OF THE INVENTION

This application claims priority based on a provisional application titled Durable Card bearing serial number 81/783,948 filed February 13, 2013 whose teachings are incorporated herein by reference.

This invention relates to cards, such as credit cards, plastic cards for ID, financial transactions and other uses, having improved durability and appearance and to apparatus arid methods for making such cards. Included in the manufacture is the application of a clear laminate during the manufacture of the cards.

The use of plastic credit cards is widespread. A problem with known plastic cards is that they warp and wear out from repeated us (e.g., within 3-5 years and after 4000 uses -swipes of the magnetic stripe) and the markings become faint or scratched. It has therefore been an aim of the industry to make cards which are sturdier and whose markings do not fade with repeated use. That is, it is desirable to have plastic cards that can last many (e.g., 5-10) years and which can be subjected to a very large number (e.g., 10,000) of uses; especially magnetic stripe use.

In the past, attempts were made to make the credit card surface harder. For example, cards were made with an ultra violet cured coating. However, all such harder cards were prone to develop cracks due to stress over time. This made these cards undesirable for their intended use. i St is therefore desirable to manufacture a hardy, scratch resistant plastic card which is not prone to develop cracks and to make such cards easy and economical to manufacture.

If is also desirable to manufacture a metal card which is scratch resistant and is also more durable.

SUMMARY OF THE INVENTION

Cards embodying the invention include a hard coat layer formed on top and/or on the bottom of the card. The hard coat layer may be formed of nano-particles, such as silicate nanoparticles, zinc oxide nanoparticles, silicon dioxide crystalline nano- particles, or an other suitable nano-particles with a suitable carrier such as a solvent of water based acrylates, vinyls, urethane or the fike. The hard coat can be applied by coating techniques such as gravure, reverse roll, direct roll, or slot coating.

The hard coat layer may be applied to a card, or to a subassembly used in forming a card, by means of a special carrier layer. The special carrier enables a release layer and a hard coat layer to be attached to the special carrier layer to form a subassembly which can then be attached and transferred to another subassembly to form an intermediate assembly from which the carrier and release layers can be removed, leaving the hard coat layer as the top and/or bottom layer of the card.

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers or essentially purely metal layers. The core subassembly may also include;

(a) a semiconductor chip containing selected electronic circuits and an antenna coupled to the chip for enabling contacfless radio frequency (RF) communication with an external reading device; and/or

(b) a semiconductor chip with contacts to an externa! surface of the card to enable direct "contact" communication with an external reading device.

Cards embodying the invention include an energy absorbing buffer layer formed between a hard coat layer and a layer intended to be treated (e.g., personalized) with a laser.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings, which are not drawn to scale, like reference characters denote like components; and

Fig. 1A is a highl simplified cross sectional diagram of a ''core" plastic card sub assembly (subassembly A) which may be used in practicing the invention;

Fig. 1A1 is an isometric diagram of a core, contactless, plastic card subassembly showing various layers of the subassembly including a layer carrying a chip and one carrying an antenna;

Fig. 1A2 is a highl simplified cross sectional diagram of a "core contact" plastic card sub assembly (subassembly A) which may be used in practicing the invention; Fig. 1B is a highly simplified cross sectional diagram of a hard coal layer sub assembly (subassembly B) intended to be combined with assorted core subassemblies to form durable cards embodying the invention;

Fig. 1C is a highly simplified cross sectional diagram of a core plastic card sub assembly (subassembly A) combined wit a hard coat layer sub assembly

(subassembly B) in accordance with the invention;

Fig. 1D is a highly simplified cross sectional diagram of a resultant durable plastic card with a hard coat layer in accordance with the invention;

Fig. 2 is a highly simplified cross sectional diagram of a core plastic card sub assembly (subassembl A) combined with hard coat subassemblies located on the top and bottom sides of the card;

Fig. 2A is a highly simplified cross sectional diagram of a resultant durable plastic card with hard coat layers on the top and bottom side of the card in accordance with the invention;

Fig. 3A is a highl simplified cross sectional diagram of prior art platens used in the manufacture of cards;

Fig. 3B is a highly simplified cross sectional diagram of platens embodying an aspect of the invention used in the manufacture of cards;

Fig. 4A is a highly simplified cross sectional diagram of a metai card assembly for manufacturing a durable metal card in accordance with the invention; Fig. 4A1 is an isometric diagram of a core, contactiess, metal-plastic card subassembly showing various layers of the subassembly including a layer carrying a semiconductor chip and one carrying an antenna;

Fig. 4A2 is a cros sectional diagram of part of a core metal-plastic card subassembly which includes a moduie and antennas so the subassembly can be used to form a contact card and/or a contactless card;

Fig. 4B is a highly simplified cross sectional diagram of a resultant durable metai card formed with a hard coat layer on the top and bottom sides of the card in

accordance with the invention;

Fig. 5A is a highl simplified cross sectional diagram of a "brushed" metai card assembly for manufacturing a durable metal card in accordance with the invention;

Fig, 5B is a is a highly simplified cross sectional diagram of a durable "brushed" metal card formed with a hard coat layer on the top and bottom sides of the card in accordance with the invention;

Fig. 6A is a highly simplified cross sectional diagram of an "embedded" metai card assembly for manufacturing a durable metal card in accordance with the invention;

Fig. 68 is a highly simplified cross sectional diagram of a "hybrid" metal card assembly for manufacturing a durable metal card in accordance with the invention;

Fig. 7 is a flow chart diagram showing various processing steps in forming cards embodying the invention; Fig. 8 is a diagram illustrating the use of an energy absorbing buffer layer

between a metal layer and a bard coat layer when the metal layer is subjected to a beat generating laser beam; and

Fig. 9 is a diagram illustrating the illustrating the use of an energy absorbing buffer layer between a carbon containing PVC layer and a hard coat layer when the carbon containing layer is subjected to a heat generating laser beam.

DETAILED DESCRIPTION OF THE INVENTION

As shown In the various figures, cards embodying the invention include a "core" subassembly (subassembly A or A1 , C, D, E, or F, or a subassembly as shown in Figs. 1 A2 and 4A2) which defines the functionality of the card to which is attached a hard coat subassembly (subassembly B); where the hard coat subassembly can be attached to the bottom and top sides of the cor subassembly or to only one side of the core subassembly.

The "core" subassembly may comprise: (a) a number of piastic layers attached together as shown in Fig. 1 A; or (b) a number of plastic layers with a chip and antennas (a contactless "smart" card) carried on one or more of the layers as shown in Fig. 1 A1 ; or (c) a number of plastic layers with a chip and antennas and a contact (a contact or contactless "smart" card) as shown in Fig. 1A2; or (d) a number of metal-plastic layers, forming a hybrid card, as shown in Figs. 4A and 4B; or (e) a number of metal-plastic layers, forming a hybrid card, with a chip and antennas formed on or within some of the plastic layers (a contactless "smart" card) as shown In Fig. 4A1 ; or (f) ) a number of metal-plastic layers, forming a hybrid card, with a chip and antennas formed on, or within, some of the plastic layers and with contacts extending to a surface of the card as shown in Fig. 4A2: or (g) a number of metal-plastic layers, as shown as subassembly D in Figs. 5A, 5B, as subassembly E in Fig, 6A, and subassembly F in Fig. 6B. The core subassembly could also be formed of a relatively thick metal layer.

An overview of the general processing steps performed in the manufacture of cards embodying the invention is shown in Fig. 7. As indicated in step 701 of Fig. 7, forming a "core" subassembly is one step in the process of making cards in accordance with the invention. As indicated in step 703 of Fig. 7, another step in the process is forming a hard coat subassembly B having a structure of the type shown in Fig. 1 B.

The next step as shown in step 705 of Fig. 7, is forming a "sandwich" comprising the step of attaching a hard coat subassembly to the top and bottom sides of a core subassembly (as shown, for example, in Fig. 2) or to only one side of the core

subassembly (as shown, for example, in Fig. 1C).

The next step as shown in step 707 of Fig, 7 is to laminate the sandwich to form a reliable and firm card. Of significance in the manufacture of cards embodying the invention is the use of a silicone rubber plate designed to ensure that air bubbles are removed.

The next step shown in step 709 of Fig. 7 is the removal of the special carrier and release layer leaving the exposed hard coat layer(s). After the removal of the carrier and release layers a resultant card is produced as per step 71 1. Also of significance in the manufacture of cards embodying the invention is a Sasersrig step to personalize/write on a metai core layer or on a PVC core layer of the card. The lasering step can be selectively performed at any of several points during the process of making the cards (e.g., after step 701 , or 705 or 707 or 709 or 71 1 ),

Some of the detailed steps in the manufacture of a durable card as shown in Figs 1A, 1 B, 1C and 1 D include the following:

1- As shown in Fig. 1A, information (103a, 103b) may be printed in, or on, a core polyvinyl chloride (PVC) layer 101. A dear plastic layer 102a positioned above layer 101 and another clear plastic layer 102b positioned below layer 101 are laminated together with layer 101 using standard processing equipment. A magnetic stripe layer 120 may foe laminated with layers 101 , 102a and 102b at the same time or subsequently thereto. The laminated assembly of layers 102a, 10 , 102b and 120 is identified as subassembly A, which represents a core subassembly suitable for practicing the invention. .

2- As shown in Fig. 1 A1 subassembly A may be modified to include a layer 100 carrying a booster antenna 14 and a layer 100a carrying a chip module 12 and a chip antenna 13, Layers 100 and 100a may be two separate layers or there may be one plastic layer carrying the chip module and the antennas. The chip module, also referred to as a semiconductor chip or an integrated circuit (SC) includes electronic circuitry which is connected to antenna 13 inductively coupled to antenna 14 to enable the module 12 to communicate via confactless radio frequency (RF) with an external card reading device (not shown). For ease of reference a subassembly A modified to include a chip s and antenna(s) may be identified as a subassembly A1 , which represents another "core" subassembly suitable for practicing the invention.

- Note that, as shown in Fig. 1A2, the subassembly A may also be modified to include contacts extending from the module 12 to contact points 121 , 123 along an external surface of a card. These contacts (121 , 123) enable an external card reader (not shown) to directly contact and interact with the chip module 12. The modified subassembly also represents another core subassembly suitable for practicing the invention.

- As shown in Figs. 1B and 1C, a hard coat sub-assembly B is formed to be combined with a core subassembly (A or A1 ) to form a durable card embodying the invention. Subassembly B is referred to herein as a hard coat subassembly. As shown in Fig. 1B, subassembly 8 includes a special carrier layer 104 on which is positioned a release layer 106 on which is formed a hard coat layer 108 on which is formed a primer layer 110 to which is attached an adhesive layer 1 12. The layers forming subassembly B can come in rolls or sheets (films) which are stacked on top of each other in the prescribed order and then processed (combined) in the following manner. Heat and pressure are applied to the layers forming subassembly B fusing the stack of sheets (or rolls) together. The entire lamination process may occur in one or two steps depending on the equipment available. That is

subassemblies A and B may be laminated separately and then combined. Alternatively, all the layers of subassemblies A and B can be stacked together as shown in Figs. 1 C and 2 and then laminated at the same time. The layers of subassembly B have significant properties, as discussed below:

a- special carrier layer 104, the carrier materia! is typically polyester, and is typically 0.00075 inches thick. The carrier layer is formed so that a release layer and a hard coat layer (also primer and adhesive) can be formed thereon and such that the carrier and release layer can be removed, leaving the hard coat layer (108a, 108b) as the top (or bottom) layer of the card. The carrier layer 104 is important due to being specially designed to be compatible with the lamination process and to impart a special finish to the hard coat on the card.

b- The release layer 106 material is, by way of example, polyethylene wax and is approximately 0.00025 inches thick.

C" hard coat layer 108- The hard coat layer may be formed of nano-particles, such as silicate nanopartlcies, zinc oxide nanoparticles, silicon dioxide crystalline nanoparticles, or any other suitable nano-particles with a suitable carrier such as a solvent of water based acry!ates, vinyls,

urethane or the like . The hard coat can be applied by coating techniques such as gravure, reverse roll, direct roll, or slot coating. This avoids the size limitation of the vapor depositing equipment. The hard coat layer (108a, 108b) is scratch resistant and provides a very strong and long lasting surface. Bending and abrasion testing has shown that a plastic card with nano particle coating is superior to any of the e-coat jewelry finishes currently in use. - Primer layer 1 10 - matenal is typically a plastic material such as polyvinyl dichloride, or any like material, and is typically 0.0003 inches thick. In accordance with the invention, the primer layer may be made to have many different colors b adding colorants, dyes or pigments, to the plastic primer layer. This is very significant since it enables the manufacture of colored durable cards much more cheaply than using other known techniques. The color is compounded with the primer and solvents prior to its application to the sheet or roll.

e- Adhesive layer 1 12 - may be, for example, polyvinyl acetate (PVA or PVAC), or any like adhesive or glue-like material. The adhesive layer must be such that it enables subassembly B to be bonded to a core subassembly (e.g., A or A1 ); the subassembly whose components need to be protected.

In accordance with one embodiment, the various layers of subassembly B are bonded together in a platen press at a predetermined temperature for a predetermined time at a given pressure (e.g., 300 degrees F at 200psia for 10 minutes).

A core subassembly (e^g., A or A1 ) and a hard coat subassembly B are then combined together as shown in Fig. 1C or 2. The two subassemblies are then bonded (or laminated) together at a predetermined temperature for a predetermined time at a given pressure (e.g., 290 degrees F at 200 psia for 8 minutes). 8. Alternatively, all the layers of subassemblies A and B could be bonded (sandwiched) together in a one step process if the adhesive system is designed for the application,

9. The carrier layer 104 and the release layer 106 are then removed . Note that the hard coat subassembly with the carrier and release layer removed is identified as B1 in the drawings. In one embodiment, the plastic carrier layer 104 and release layer 106 are hand stripped by a lamination operator when breaking open the completed sandwiches (assemblies}. Thus is formed a durable plastic card 10 of the type shown in Figs, 1D or 2A,

10, A card 10 with the hard coat layer embodying the invention has the folSowing properties: uniform surfaces which are scratch and abrasion resistant,

11 , Laserability - A laser (e.g., a YAG laser) can be used for personalization of the resulting outside card surface. Note that a !asering operation can be performed at many different points during the manufacturing process. The lasering may be performed at or on the surface of a card assembly or two layers within the core subassembly.

11 (a) - Laserability of cards which include only plastic iayers - As shown in Fig. 1 C, selected Iayers (e.g., clear PVC laminate Iayers102a_! 102b or in an optional PVC overlay) of a core subassembly may be formed to contain laser reactive carbon particles 901. Carbon particles and fumed silica which can be laser reactive ingredients can be formed in the printed PVC or polymer layer or in the polymer overlay. Heat from the laser (e.g., 402) causes carbon particles in these Iayers to char and the surrounding area turns dark. With extra power from the layer i the same spot the silica steams off its water and causes the area to turn a tight color. Thus the laser is capable of making both light and dark marks on the same plastic surface.

11 (b) LaserabiSsty of cards which include a metal layer- This process shows good contrast and is very secure since the hard coat layer can be ablated down to the bare surface of the underlying metal. Note the hard coat layer Is either ablated if it is in direct contact with the metal surface or unaffected (if adhesive and plastic layers are attached to the metal surface) depending upon how the print and background qualities of the card affect the laser beam reflection and absorption. Sometimes, with a powerful laser the surface of the metal may also be affected causing bright bare metal to remain.

The manufacture and processing of the proposed product will result in significant cost savings over alternative methods due to a reduction of surface scratching. Card life in the field is also extended.

Figs. 2 and 2A illustrate that a hard coat layer can be formed on the top and on the bottom (both sides) of a card. Fig. 2 shows that a subassembly B, denoted as B{a), can be attached to the top side of a plastic core subassembly A and that a like subassembly B, denoted as B(b), can be attached to the bottom side of subassembly A with B(b) being the symmetrically disposed mirror image of Bfa) when folded about the center core. The entire sandwich of subassemblies B(a), A and B(b) can be laminated as discussed above. After lamination, the carrier and release layers 104a, 108a and 104b, 108b are removed. This results in a card of the typ shown in Fig. 2A where hard coat layers 108a and 108b are formed as the topmost and bottommost layers of the card 10. The advantage of providing a hard coat layer 108b over the magnetic stripe !ayer120 is that it would ensure that the magnetic stripe layer would not be worn out over the useful fife of the card. The hard coat can be appiied only over the magnetic stripe (leaving the signature panel open) or if a full layer of hard coat is applied, a laser signature can be used during personalization instead of a customer hand signed card signature.

The lamination step includes the use of separate heated and cooled platens to apply pressure at a predetermined temperature to the sandwich. Prior art platens as shown in Fig. 3A include the use of standard polished steel plates (301a, 301 ) heated to the desired temperature to apply the desired pressure to selected layers. A problem with the prior art platens was thai air bubbles within the layers could not escape. This caused defects on the laminated sheet. This problem is overcome by replacing the polished steel plates/pads with silicone rubber plates 31 la, 311b, as shown in Fig. 3B, to laminate cards embodying the invention. The use of a silicone rubber pads over the platens can provide a degree of flexibility in that it allows pressing of the hard coat into irregular areas of the sheet. This helps squeeze out air bubbles.

Furthermore, to overcome problems of manufacture and completely remove air entrapment a special vacuum lamination platen under heat and hydraulic pressure can be used with a high heat high pressure short cycle. The cards shown in the figures and formed in accordance with the invention benefit from the vacuum lamination process by completely removing air form the process. The handling methods developed overcome lack of surface consistency by using special 30 durometer 032 to 062 thick silicone rubber.— with or without vacuum.

Lamination using silicone rubber platens a!so can overcome lack of surface consistency by providing a more even pressure which overcomes any inconsistency in material surface and thickness.

Relative to a metal core or hybrid card using the hard coat technique allows the user to achieve a holographic, multi-dimensional effect on stainless steel or similar metal substrate with a polished or mill finish by laser engraving an image removing a physical vapor deposition (PVD) or like pigmented coating. This may be achieved by creating a pseudo lenticular lens, and changing the refractive index of the image on different layers. This may be further enhanced by creating a polarization pattern in the layers, creating a polarized light effect.

Metal cards -

!n accordance with the invention, the hard coat subassemblies may be combined with core subassemblies which include metal layers to form metal-plastic or mostly metal cards which are highly scratch resistant and even more durable.

Figs. 4A and 5A are highly simplified cross sectional diagrams of a primarily metal card assembly for manufacturing a durable metal card in accordance with the invention. The metal layer 101 may include an optional adhesive film (103a, 103b) above it top and bottom surfaces. The optional adhesive films 103a, 103b are desirably used when the top and/or bottom surface of the metal layer 101 has been "brushed" as shown in Fig. 5A. The "brushing" may be accomplished by forming indentations in the surface of the metal layer done to give the metal layer and the resultant card a distinctive feature. The films 103a and 103b when applied to the brushed metal surfaces tend to smooth out the sharp edges and fill the depressions present on the brushed surfaces. This soives a problem when the ridges formed in the metal surfaces due to the "brushing" exceed the thickness of the hard coat laye and tend to wear through the hard coat layer. The core metal card subassembly (C in Fig. 4A, D in Fig. 5A) is shown to include a magnetic stripe and/or a hologram layer 120 on the bottom side of the metal layer. In Figs. 4A and 5A, the card assembly sandwich also includes a sub assembly Ba applied (sandwiched) on top of the optional adhesive film 103a and a subassembly Bb applied {sandwiched} below layer 120,

Note that the metal layer 101 may be stainless steel and have a "whitish" color. There is provided in subassemblies Ba and Bb a primer layer 110a, 1 10b which may be colored to give the card a desired color. Alternatively, the primer layer may be clear.

The sandwich assembly shown in Figs. 4A and 5A is subjected to a lamination process under predetermined pressure and temperature. Thereafter, the carrier and release layers are removed leaving a resultant card of the type shown in Figs. 4B or SB. Thus, Figs. 4B and 58 are highly simplified cross sectional diagrams of a durable scratch resistant metal card formed with a hard coat layer on the top and bottom sides of the card in accordance with the invention. In Figs. 4A and 5A, the thickness of the metal layer 101 may be, but need not be, nearly the full thickness of the card. Fsg. 8A is similar to Figs. 4A and 5A except that an additional printed dear PVC layer 105a is applied above the metal layer 101 and an additional printed clear PVC layer 105b is applied below the metal layer 101. The PVC layers 105a, 105b, enable the metal layer 101 of Fig. 6A to be made thinner than the metal layer 101 of Figs. 4A and 5A. For example, the thickness of its metal layer may be 1/3 that of Figs. 4A and 5A. Fig. 6A may be referred to as a durable card with an "embedded" metal layer.

Fig. 6B is similar to Fig. 8A except that at least one of the PVC layers may be eliminated. The metal layer of Fig. 6B would be thicker than that of Fig. 8A but thinner than that of Figs, 4A or 5A. Fig. SB may be referred to as a hybrid durable metal card. Note that the resultant cards formed from the assemblies shown in Figs. 6A and 6B have a hard coat layer on their top and on the bottom surfaces.

As already discussed a "core" subassembly as used herein refers to those layers of the card which define the functionality or function to be performed by the card. A "core" subassembly may be a subassembly such as defined as subassembly A, A1 , or in Fig. 4A2, C, D, E or F).

Figs. 8 and 9 illustrate a solution to a problem which exists when a hard coat layer is used. It is noted that a problem exists when a hard coat layer is formed so as to be in direct contact with a metal layer or a plastic layer containing laser reactive (e.g., carbon) particles and the metal layer or a plastic layer undergoes a lasering operation. When the laser is applied to the metal layer or to the laser reactive plastic layer, a substantial amount of heat (energy) is generated. When this generated heat is applied to the hard coat layer, the hard coat layer is subjected to cracking and to being effectively destroyed.

In Fig. 8 the "cracking" problem is overcome by forming an energy absorbing layer (e.g., 808a_t 808b) between a metal !ayer (e.g., 101) and associated hard coat layers (108a, 108b). The energy absorbing layer (e.g., 808a, 808b) may be of any suitable material to absorb or dissipate the energy generated to prevent cracking of the hard coat layer, !n some embodiments a primer layer 110 in addition to an adhesive layer 112 formed between the hard coat layer and the metal layer were sufficient to protect the hard coat layer from the heat generated by the laser's action. A energy absorbing buffer layer may be comprised, for example, of an extruded poiymer film, and can be composed of any of the polymeric films known in the art such as PET (Polyethylene Terephthalate), PETG (Polyethylene Terephtha!aie Glycol), or PVC (Polyvinyl Chloride).

In Fig. 9 the "cracking" problem is overcome by forming an energy absorbing layer (e.g., 908) between a laser reactive carbon containing plastic layer (e.g., 902) and associated hard coat layers (1080. The energy absorbing layer (e.g., 908) may be of any suitable material to absorb or dissipate the energy generated to prevent cracking of the hard coat layer, as discussed above for Fig, 8.

Claims

WHAT IS CLAIMED IS:

1. A method of forming a card comprising the steps of;

forming a first core subassembly comprised of two or more layers which include the elements defining the functionality of the card; said first core subassembly having a top layer and a bottom layer;

forming a second subassembly including a hard coat layer attached to a release layer mounted on a carrier Iayer;

attaching the second subassembly to the top layer of the of the first core subassembly so the hard coat layer is closest to the first core assembly to form a first card assembly;

laminating the first card assembly under predetermined temperature and pressure; and

removing the release Iayer and the carrier layer to form a resultant card.

2. A method as claimed in claim 1 wherein the hard coat layer includes nano- particles, such as silicate nanopartic!es, zinc oxide nanoparticles, silicon dioxide crystalline nanoparticles, or any other suitable nano-particles with a suitable carrier such as a solvent of water based acrylates, vinyls, urethane or the like .

3. A method as claimed in claim 1 wherein the hard coat subassembly includes a plastic primer layer underlying the hard coat layer and wherein there is included the step of adding colorants, dyes or pigments, to the plastic primer layer for enabling the manufacture of colored durable cards.

4. A method as claimed in claim 1 wherein step of laminating the first card assembly includes the step of removing air bubbles and surface imperfections.

5. A method as claimed in claim 1 wherein step of laminating the first card

assembly includes the step of using silicone rubber platens which function to apply pressure to remove air bubbles trapped within the layers of the first card assembly and to smooth the surface of the f irst card assembly,

6. A method as claimed in claim 1 wherein another one of said second

subassembly is attached to the bottom layer of the first core subassembly to form said first assembly; and wherein the release layer and the carrier layer of said another one of said second subassembly are removed to form a resultant card.

7. A method as claimed in claim 1 , wherein the first core subassembly includes a core plastic layer, clear PVC layers with graphics on selected ones of the PVC layers and a magnetic stripe.

8. A method as claimed in claim 7, wherein the first core subassembly also includes at least one of the following: (a) an integrated circuit and an antenna for enabling radio frequency communication with an external reading device; and (b) an integrated circuit with contacts extending to a surface of the card for enabling direct contact and communication between an external device and the integrated circuit.

9. A method as claimed in claim 1 , wherein the first core subassembly includes a metal core layer.

10. A method as claimed in claim 9, wherein the first core subassembly also includes at least one of the following: (a) an integrated circuit and an antenna for enabling radio frequency communication with an external reading device; and (b) an integrated circuit with contacts extending to a surface of the card for enabling direct contact and communication between an external device and the integrated circuit.

11. A method as claimed in claim 1 , further including the step of selectively !asering the first core subassembly,

12. A method as claimed in claim 7 wherein one of said layers forming said first core subassembly includes laser reactive particles and wherein there is included the step of lasering said laser reactive particles.

13. A method of forming a card comprising the steps of:

forming a first core subassembly comprised of two or more layers including the elements defining the functionality of the card; said first core assembly having a top layer and a bottom layer;

forming first and second hard coat subassemblies, each hard coat subassembl including a hard coat layer attached to a release layer mounted on a carrier layer;

attaching said first hard coat subassembly to the top layer of said first core subassembly and attaching the second hard coat subassembly to the bottom layer of said first core subassembly to form a first assembly;

laminating the first assembly; and

removing the release layers and the carrier layers of the first and second subassemblies.

14. A card including:

an externa! hard coat layer which when exposed to intense heat tends to crack;

an interna! core !ayer which can be personalized with a laser and which develops intense heat at points being iasered; and

at least one p!astic buffer layer between the external hard coat layer and the interna! core layer to absorb and dissipate the heat energy produced at and within the core layer when being personalized with a laser and functioning to biock the heat energy and preventing the cracking of the external hard coat layer.

15. A card as claimed in claim 14 wherein the internal core layer includes a laser reactive plastic layer responsive to a laser beam.

16. A card as claimed in claim 14 wherein the interna! core layer includes a laser reactive plastic layer containing carbon particles responsive to a laser beam.

17. A card as claimed in claim 14 wherein the internal core layer includes at least one of the following: (a) an integrated circuit and an antenna for enabling radio frequency communication with an external reading device; and (b) an integrated circuit with contacts extending to a surface of the card for enabling direct contact and communication between an external device and the integrated circuit.

8. A card as claimed in claim 14 wherein th internal core layer includes a metal layer.

19. A card as claimed in claim 14 wherein the buffer layer is at least one of the

following: (a) a plastic materia! such as polyvinyl dichforide, or any !ike materia!; (b) a piastic material to which is added colorants, dyes or pigments; (c) a plastic material such as polyvinyl chloride (PVC), or polyvinyl acetate (PVAC),

amorphous polyethylene terephthaSate (APET), Polyethylene Terephthaiate Glycol (PETG), or any like polymer.

20. A method for enabling the personalizing of cards having an externaS hard coat layer overlying an internal core layer which is to be personalized and wherein the laser beam has to pass through the hard coat layer before impacting the internal core layer, comprising the steps of:

forming at least one buffer layer between the hard coat layer and the core layer, said buffer Iayer characterized in that it. can absorb energy and heat imparted to the internal core Iayer by a laser and prevent the heat generated due to the laser from adversely affecting the hard coat layer.